The DESY II test beam facility

Diener, Ralf; Dreyling-Eschweiler, Jan; Ehrlichmann, H.; Gregor, I. M.; Kötz, U.; Krämer, Uwe; Meyners, N.; Potylitsina-Kube, N.; Schütz, Anne; Schütze, P.; Stanitzki, M. M.

doi:10.1016/j.nima.2018.11.133

Cited by 182 publications

(158 citation statements)

References 14 publications

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“…The layers are referenced by their numbers from 1 to 7, starting from the front face. The detector was commissioned in the laboratory and afterwards exposed to a low energy positron beam in the DESY test beam area (line 24) [14] with the first layer located upstream . All the results in this paper were obtained with the detector running in power pulsing mode, with gated acquisitions of 1 − 3 ms at frequencies of 1 − 5 Hz.…”

Section: The Siw-ecal Technological Prototypementioning

confidence: 99%

Beam test performance of the highly granular SiW-ECAL technological prototype for the ILC

Kawagoe

Miura

Sekiya

et al. 2020

Nuclear Instruments and Methods in Physics Research Section A:

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The technological prototype of the CALICE highly granular silicon-tungsten electromagnetic calorimeter (SiW-ECAL) was tested in a beam at DESY in 2017. The setup comprised seven layers of silicon sensors. Each layer comprised four sensors, with each sensor containing an array of 256 5.5 × 5.5 mm 2 silicon PIN diodes. The four sensors covered a total area of 18 × 18 cm 2 , and comprised a total of 1024 channels. The readout was split into a trigger line and a charge signal line. Key performance results for signal over noise for the two output lines are presented, together with a study of the uniformity of the detector response. Measurements of the response to electrons for the tungsten loaded version of the detector are also presented.

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Section: The Siw-ecal Technological Prototypementioning

confidence: 99%

Beam test performance of the highly granular SiW-ECAL technological prototype for the ILC

Kawagoe

Miura

Sekiya

et al. 2020

Nuclear Instruments and Methods in Physics Research Section A:

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“…Detailed scans have been performed with the MuPix-Telescope [10]. For sub-pixel studies the high precision of the Eudet-Telescope [11] is utilized, using a 3 GeV electron beam at the DESY test beam facility.…”

Section: Resultsmentioning

confidence: 99%

“…By varying the bias voltage from −5 to − 50 V one expects a growth of the depletion zone by more than a factor 3 and further achieves a full lateral depletion in-between the pixels. To further confirm the full lateral depletion a sub-pixel analysis is performed with the help of the high resolution Eudet-Telescope [11]. The results are shown in figure 7, folding the full matrix to 2 × 2 pixels for improved statistics.…”

Section: Efficiency and Noise Performancementioning

confidence: 99%

Performance of the large scale HV-CMOS pixel sensor MuPix8

Augustin

Berger²,

Blattgerste³

et al. 2019

J. Inst.

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A: The Mu3e experiment is searching for the charged lepton flavour violating decay µ + → e + e − e + , aiming for an ultimate sensitivity of one in 10 16 decays. In an environment of up to 10 9 muon decays per second the detector needs to provide precise vertex, time and momentum information to suppress accidental and physics background. The detector consists of cylindrical layers of 50 µm thin High Voltage Monolithic Active Pixel Sensors (HV-MAPS) placed in a 1 T magnetic field. The measurement of the trajectories of the decay particles allows for a precise vertex and momentum reconstruction. Additional layers of fast scintillating fibre and tile detectors provide sub-nanosecond time resolution. The MuPix8 chip is the first large scale prototype, proving the scalability of the HV-MAPS technology. It is produced in the AMS aH18 180 nm HV-CMOS process. It consists of three sub-matrices, each providing an untriggered datastream of more than 10 MHits/s. The latest results from laboratory and testbeam characterisation are presented, showing an excellent performance with efficiencies > 99.6 % and a time resolution better than 10 ns achieved with time walk correction. K: HV-CMOS, particle tracking detectors, monolithic active pixel sensors 1Corresponding author. 2Now at DESY,

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“…It was found that the combination of Ti/W/Cu Under Bump Metalisation (UBM) used for the FBK-CMM sensors and SnAg bump material used by IZM produced the best results. Test-beam results : Assembly 20 was tested using the DATURA beam telescope set-up [10] in the DESY II test-beam area [11]. The DESY-II synchrotron supplies an electron/positron particle beam of energies up to 6 GeV, and a nominal beam energy of 5.4 GeV was chosen for data taking.…”

Section: High Ratementioning

confidence: 99%

R&D for the CLIC vertex and tracking detectors

Williams

2020

J. Inst.

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A : Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear accelerator provide a clean, low-radiation environment for the inner detectors. However, physics-driven performance targets, the CLIC beam structure, and occupancies from beam-induced backgrounds place challenging requirements on detector technologies for this region. A pixel pitch down to 25×25 µm 2 , material budget ≤ 0.2-2%X 0 per layer, average power dissipation of down to 50 mW cm −2 , position resolution of 3-7 µm, and timing resolution as low as 5 ns are called for in the vertex and tracking detectors. To this aim, a comprehensive R&D programme is ongoing to design and test silicon pixel detectors to fulfil these specifications, including both monolithic and hybrid devices. These studies involve Allpix 2 Monte Carlo and TCAD simulations, advanced 65 nm ASIC and sensor design, laboratory testing, and beam tests of individual modules to determine the required performance parameters. The characterisation and simulation modelling of these devices has also lead to the development of a set of tools and software within the CLIC detector and physics (CLICdp) collaboration. This publication will present recent results from the technologies being developed and tested in view of the CLIC vertex and tracking detector requirements, such as various monolithic CMOS sensors, and fine pitch hybrid assemblies with planar sensors.

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The DESY II test beam facility

Cited by 182 publications

References 14 publications

Beam test performance of the highly granular SiW-ECAL technological prototype for the ILC

Beam test performance of the highly granular SiW-ECAL technological prototype for the ILC

Performance of the large scale HV-CMOS pixel sensor MuPix8

R&D for the CLIC vertex and tracking detectors

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