2013
DOI: 10.1016/j.cap.2012.10.001
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The diffusion of silicon atoms in stack structures of La2O3 and Al2O3

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Cited by 8 publications
(8 citation statements)
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“…The intensity of the O–Al (Figure 6e,f) and Al–O (Figure 6h,i) peaks increase as the sputtering time increases. As reported in [41,42,43], the binding energy of O–Al (531.2 eV) shown in the O 1s spectra and the binding energy of Al–O (74.4 eV) shown in the Al 2p spectra were attributed to A1 2 O 3 . Moreover, the O–Al peak in Figure 6e,f and the Al–O peak in Figure 6h,i clearly indicated that there was only one peak and that no peak shifts occurred, which indicated that the Al had only one chemical state: Al 3+ .…”
Section: Resultssupporting
confidence: 65%
“…The intensity of the O–Al (Figure 6e,f) and Al–O (Figure 6h,i) peaks increase as the sputtering time increases. As reported in [41,42,43], the binding energy of O–Al (531.2 eV) shown in the O 1s spectra and the binding energy of Al–O (74.4 eV) shown in the Al 2p spectra were attributed to A1 2 O 3 . Moreover, the O–Al peak in Figure 6e,f and the Al–O peak in Figure 6h,i clearly indicated that there was only one peak and that no peak shifts occurred, which indicated that the Al had only one chemical state: Al 3+ .…”
Section: Resultssupporting
confidence: 65%
“…2b) La 2 O 3 films, the lanthanum and oxygen in-depth distributions in the EDX elemental ratio profiles show a parallel profile and the La/O ratio is close to 2:3 which meets well with the stoichiometry of La 2 O 3 . In the HRTEM images, an amorphous region between the Si substrate and the fabricated film, corresponding to an interfacial layer (IL) formed during the ALD growth and RTA process [24], could be found in both Fig. 2a, b.…”
Section: Resultsmentioning
confidence: 99%
“…The intensity of Si + in sample S4 is at least an order magnitude less than that in sample S1, which suggests that the deposited Al 2 O 3 barrier layer (15 cycles) in sample S4 indeed suppresses the diffusion of Si atoms from the Si substrate into the La 2 O 3 layer during the thermal process, in good agreement with the XPS results. Due to the formation of pinholes in the Al 2 O 3 barrier layer during the 700°C RTA treatment [18], the diffusion of Si atoms is not completely suppressed. HRTEM analysis reveals the existence of a thicker IL in the sample without an Al 2 O 3 barrier layer, and now this result can be further confirmed from the intensity of SiO 3 − signals which indicate the presence of a SiO x -like component existing in the region of the nanolaminate/substrate interface.…”
Section: Resultsmentioning
confidence: 99%