The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions

Liang, Chien Lung; Lin, Kwang Lung; Cheng, Po Jen

doi:10.1007/s10853-017-1312-2

Cited by 12 publications

(4 citation statements)

References 27 publications

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“…Au content increases from 4.59–4.91 Wt.% to 11.18–12.04 Wt.% and from 3.44–4.48 At.% to 9.69–10.92 At.% in the IMC formed along the solder joint crack path. The significant increase of Au content (and hence the reduction of other elements) during thermal cycling validated the migration of the elements towards the solder joint interface, leading to the increase in the formation of the unwanted Au-based IMC, which creates an embrittlement issue in the Sn-rich phase of the solder joint and resulting in the propagation of the already-initiated crack (Liang et al , 2017). This phenomenon culminated in the increment of Au-Sn IMC at the solder joint interface of the thermally cycled package, leading to a crack growth mechanism that propagates through the solder joint's Au-Sn IMC (Pan et al , 2011).…”

Section: Resultsmentioning

confidence: 99%

“…Studies by many researchers in the past decade have shown that the microstructural contents of lead-free solders determine their plastic and creep behaviour during the thermal cycling process (Lin and Chu, 2005; Wiese and Wolter, 2007). Studies have also established that their microstructural contents greatly impact the mechanical reliability of lead-free solder jois (Liang et al , 2017; Pang et al , 2004). The formation of Au-Sn-based intermetallic compound (IMC) at the interface of lead-free solder joint indicates the joint's good wetting and bonding properties.…”

Section: Introductionmentioning

confidence: 99%

“…The formation of Au-Sn-based intermetallic compound (IMC) at the interface of lead-free solder joint indicates the joint's good wetting and bonding properties. Still, the IMC layer's growth negatively impacts the solder joint's strength (Liang et al , 2017). This is because the IMC strengthens the solder joint, but an increase in its thickness results in void formation, which acts as a crack initiator.…”

Section: Introductionmentioning

confidence: 99%

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Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Apalowo,

Abas,

Che Ani

et al. 2024

SSMT

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Purpose This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling. Design/methodology/approach The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method. Findings The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints. Practical implications Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism. Originality/value Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Apalowo,

Abas,

Che Ani

et al. 2024

SSMT

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show abstract

“…Many studies have focused on understanding the electrically, mechanically and thermally induced reliability issues in lead-free solder joints (Bharath Krupa Teja et al , 2022; Zhang et al , 2010). It has been shown that the mechanical reliability of solder joints is greatly affected by their microstructural contents (Liang et al , 2017; Pang et al , 2004). It has also been established that the creep behavior of lead-free solders is determined by their microstructural contents (Lin and Chu, 2005; Wiese and Wolter, 2007).…”

Section: Introductionmentioning

confidence: 99%

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Apalowo,

Abas,

Muhamed Mukhtar

et al. 2024

SSMT

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Purpose This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue. Design/methodology/approach The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated. Findings Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length. Practical implications This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints. Originality/value The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

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The Microstructure and Properties of In25Pb75 Solder Joints During Aging and Temperature Cycling Test

Pu¹,

Yu²,

Bao³

2022

Proceedings of the Eighth Asia International Symposium on Mechatronics

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The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions

Cited by 12 publications

References 27 publications

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

The Microstructure and Properties of In25Pb75 Solder Joints During Aging and Temperature Cycling Test

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