The dynamic response of He bubble in bicrystal copper under uniaxial compression and tension

Qi, Zhu; Shao, Jian-Li; Wang, Pei

doi:10.1016/j.jnucmat.2022.154200

Cited by 11 publications

(2 citation statements)

References 45 publications

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“…This quasi-isentropic compression with increasing temperature is an adiabatic process under high pressure, demonstrating the dynamic behaviors of materials. [59,60] The value of strain rate for these simulations is set to 5×10 9 s −1 , which is comparable to shock compression. [46] Furthermore, we employ the GB3 model to investigate the effects of strain rates, using a wide range of compressive strain rates ranging from 2×10 9 s −1 to 1×10 11 s −1 .…”

Section: Methodsmentioning

confidence: 99%

Quasi-plastic deformation mechanisms and inverse Hall–Petch relationship in nanocrystalline boron carbide under compression

Yue 岳,

Li 李,

Liu 刘

et al. 2024

Chinese Phys. B

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Grain boundary (GB) plays a significant role in the deformation behaviors of nanocrystalline ceramics. Here, we investigate the compression behaviors of nanocrystalline boron carbide (n-B4C) with varying grain sizes, using molecular dynamics simulations with a machine-learning force field. The results reveal quasi-plastic deformation mechanisms in n-B4C: GB sliding, intergranular amorphization, and intragranular amorphization. GB sliding arises from the presence of the soft GBs, leading to intergranular amorphization. Intragranular amorphization arises from the interaction between grains with unfavorable orientations and the softened amorphous GBs, finally causing structural failure. Furthermore, the n-B4C models with varying grain sizes from 4.07 nm to 10.86 nm display an inverse Hall-Petch relationship due to the GB sliding mechanism. A higher strain rate in n-B4C often leads to higher yield strength, following a 2/3 power relationship. These deformation mechanisms are critical for the design of ceramics with superior mechanical properties.

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Section: Methodsmentioning

confidence: 99%

Quasi-plastic deformation mechanisms and inverse Hall–Petch relationship in nanocrystalline boron carbide under compression

Yue 岳,

Li 李,

Liu 刘

et al. 2024

Chinese Phys. B

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“…As for a He bubble in a GB, the related research is relatively limited. Recently, we studied the dynamic response of He bubbles in bicrystal Cu under uniaxial compression and tension and revealed the effect of He bubble positions (in grain interiors and GBs) for different loading orientations [ 29 ]. However, the coupling effect of a He bubble and a GB on the mechanical behavior under shock loading has not been addressed exclusively.…”

Section: Introductionmentioning

confidence: 99%

The Shock-Induced Deformation and Spallation Failure of Bicrystal Copper with a Nanoscale Helium Bubble via Molecular Dynamics Simulations

Shao

Wang

2023

Nanomaterials

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Both the nanoscale helium (He) bubble and grain boundaries (GBs) play important roles in the dynamic mechanical behavior of irradiated nanocrystalline materials. Using molecular dynamics simulations, we study the shock-induced deformation and spallation failure of bicrystal copper with a nanoscale He bubble. Two extreme loading directions (perpendicular or parallel to the GB plane) and various impact velocities (0.5–2.5 km/s) are considered. Our results reveal that the He bubble shows hindrance to the propagation of shock waves at lower impact velocities but will accelerate shock wave propagation at higher impact velocities due to the local compression wave generated by the collapse of the He bubble. The parallel loading direction is found to have a greater effect on He bubble deformation during shock compression. The He bubble will slightly reduce the spall strength of the material at lower impact velocities but has a limited effect on the spallation process, which is dominated by the evolution of the GB. At lower impact velocities, the mechanism of spall damage is dominated by the cleavage fracture along the GB plane for the perpendicular loading condition but dominated by the He bubble expansion and void growth for the parallel loading condition. At higher impact velocities, micro-spallation occurs for both loading conditions, and the effects of GBs and He bubbles can be ignored.

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Atomistic explanation of compression-induced deformation mechanisms in boron carbide

Yue,

Li,

Liu

et al. 2024

Appl. Phys. A

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The dynamic response of He bubble in bicrystal copper under uniaxial compression and tension

Cited by 11 publications

References 45 publications

Quasi-plastic deformation mechanisms and inverse Hall–Petch relationship in nanocrystalline boron carbide under compression

Quasi-plastic deformation mechanisms and inverse Hall–Petch relationship in nanocrystalline boron carbide under compression

The Shock-Induced Deformation and Spallation Failure of Bicrystal Copper with a Nanoscale Helium Bubble via Molecular Dynamics Simulations

Atomistic explanation of compression-induced deformation mechanisms in boron carbide

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