The effect of a table on the thermal performance of an electronic system

Neelakantan, S.; Addison, Samuel

doi:10.1109/stherm.1998.660382

Cited by 2 publications

(1 citation statement)

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“…There are exceptions, however. Electronic systems with a relatively large bottom surface area may transfer a significant amount of heat to the support, such as a table (Neelakantan and Addison, [37]). Another example is an electronic ballast, mounted in an armature.…”

Section: The Modeling Of Complex Physical Phenomenamentioning

confidence: 99%

The conceivable accuracy of experimental and numerical thermal analyses of electronic systems

Lasance

2002

IEEE Trans. Comp. Packag. Technol.

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In the past decade, we have observed a significant worldwide increase in the use of computational codes to calculate the thermal behavior of electronic systems. The benefits of these 'virtual prototyping tools' are undisputed when it comes to performing parametric studies in early design phases. However, when the objective of the calculation is accuracy, as required for subsequent reliability and performance assessments, the discussion about the level of accuracy that we can expect in practice becomes far from trivial, as will be shown in this paper.A natural question is how accurate numerical simulations are when compared to well-designed experiments in prototypes or final products. Many studies demonstrate amazing agreement, the conclusion often being that 'validation of the numerical model' has been proven. It will be demonstrated that these conclusions are subject to serious doubts. This paper discusses 'every' topic associated with a comparison between numerical and experimental results that is based on first principles, not on fitting parameters until the two results match. The final conclusion is inevitable: the situation when all computations at the system level can be used for accurate temperature prediction is still a long way off. There are two reasons for this. The first reason is the lack of sufficiently accurate input parameters and boundary conditions. The second reason is the fact that several complex physical phenomena that rule the heat transfer behavior of electronic systems concur with complex geometries. From a practical point of view, a detailed analysis of reality cannot and will not be performed for a long time to come. Several suggestions of how to solve these problems are presented.Note: it should be stressed that the focus of the discussion related to computational fluid dynamics (CFD) is on an engineering approach, rather than a scientific approach.

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Section: The Modeling Of Complex Physical Phenomenamentioning

confidence: 99%