The conceivable accuracy of experimental and numerical thermal analyses of electronic systems

Lasance, C.J.M.

doi:10.1109/stherm.2001.915178

Cited by 12 publications

(2 citation statements)

References 20 publications

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“…In addition, CFD-based parametric analysis of a wide range of heat sink geometries and Rayleigh numbers could be computationally prohibitive. Furthermore, parametric analysis may neither be quantitatively, nor qualitatively accurate (i.e., in terms of trends) over the complete design space [28,29]. This may be compounded by convergence difficulties due to thermal plume instabilities in free convection flows, resulting in transitional flow regime [30].…”

Section: Computational Fluid Dynamics Modelingmentioning

confidence: 99%

Air cooled heat sink design optimization in free convection

Rodgers¹,

Eveloy²

2013

29th IEEE Semiconductor Thermal Measurement and Management Symposium

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The optimization of heat sink performance is becoming ever more critical in passively air-cooled applications. In this paper, an overview of analytical, semi-empirical and Computational Fluid Dynamics (CFD)-based methodologies for air-cooled heat sink design optimization in free convection is presented. The advantages and potential limitations of these design techniques are summarized. A multi-faceted heat sink design strategy is advocated, which combines the analysis techniques presented with experimentation. The need to incorporate sustainability and formal optimization in the design process is highlighted.

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Section: Computational Fluid Dynamics Modelingmentioning

confidence: 99%

Air cooled heat sink design optimization in free convection

Rodgers¹,

Eveloy²

2013

29th IEEE Semiconductor Thermal Measurement and Management Symposium

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“…An argument for the adoption of CTM as a modeling paradigm is made in [4]. In [5] a discussion of the accuracy with which CTMs might be expected to match the experimental results is provided.…”

Section: Introductionmentioning

confidence: 99%

Investigation and a practical compact network model of thermal stress in integrated circuits

Krishnamoorthy

Chowdhury

2009

ICA

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This paper first investigates the non-uniform spatial thermal distribution in sub-100nm integrated circuits. A practical network-based Compact Thermal Modeling (CTM) technique has been proposed to model this thermal stress. The proposed technique, which can be integrated with modern CAD tools, represents IC package as a network in which a set of boundary nodes serve as surrogates for physical regions of the chip. In this network a junction node represents the chip's power junction, and arcs permit thermal communication between adjacent nodes. Due to the complex nature of micro-and nano-systems, the discrete models (resulting from the finite element method (FEM) or other methods) are usually very large (of the order of 100,000). Even though modern computers are able to handle engineering problems of this size, the system-level simulation would become prohibitive if the detailed models were directly used. The proposed CTM is condensed using Static Matrix Condensation methodology where the system matrices obtained by the spatial discretization of heat transfer partial differential equation (PDE) are reduced by the elimination of heat sources, surface nodes and internal nodes, however maintaining the thermal communication among the nodes. The formal conversion of governing PDE systems to low-dimensional ordinary differential equation (ODE) systems is to reduce the complexity, and at the same time preserve the accuracy of the model. The reduced system can be used to either synthesize a resistive network or formulate a set of connection equations to be connected to higher simulation levels.

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Unsteady CFD Modelling for Electronics Cooling

Tyacke

Tucker

2007

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Sys

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Numerical simulations of the relatively low Reynolds number flow (Re=14,200, based on channel height) in a ribbed channel are made using hybrid methods originating from the aerospace industry. Based on Reynoldsaveraged Navier Stokes (RANS) and Large Eddy Simulation (LES), hybrid methods are explored using RANS-LES and RANS-Implicit-LES (RANS-ILES) models. Using a hybrid method with simple models we see how coarse we can make the grid and obtain reasonable heat transfer predictions for this particular case.Results from using different LES and hybrid RANS-(I)LES approaches are in better agreement than those using different RANS models..

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The conceivable accuracy of experimental and numerical thermal analyses of electronic systems

Cited by 12 publications

References 20 publications

Air cooled heat sink design optimization in free convection

Air cooled heat sink design optimization in free convection

Investigation and a practical compact network model of thermal stress in integrated circuits

Unsteady CFD Modelling for Electronics Cooling

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