The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

Raeder, C. H.; Felton, L.E.; Tanzi, V. A.; Knorr, D. B.

doi:10.1007/bf02653346

Cited by 119 publications

(51 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Eutectic Sn-Bi solder has been recognized as a promising low-temperature lead-free solder [1][2][3] , due to its low melting point (138 C 4) ) and higher tensile strength when compared to that of eutectic Pb-Sn solder 5) . Low-temperature soldering allows the fabrication of inexpensive printed circuit boards without high-temperature resistance.…”

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

View full text Add to dashboard Cite

A comparative study of the formation, growth, and morphology of the interfacial intermetallic compounds (IMCs) of the eutectic Sn-Bi and Sn-Bi-Zn solder joints was conducted, and the shear strengths of the two solder joints were evaluated. The cross-sectional microstructures of the joints were investigated and the fracture surfaces of the joints were examined after the shear tests. The results of the microstructural analysis of the joints indicated that the addition of Zn suppressed the growth of the interfacial IMCs signi cantly after both re ow and thermal aging. Although the shear-test results indicated that the addition of Zn decreased the shear strength of the Sn-Bi solder joint, the fracture surface examination after the shear tests revealed the cause of the degradation of the shear strength and a possible solution to prevent this degradation is suggested in the paper.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

View full text Add to dashboard Cite

show abstract

“…This alloy possesses the merits of low melting point (138°C), high tensile strength (Ref 1), and good creep resistance (Ref 2,3). On the other hand, the Au/Ni metallization has been one of the most commonly used surface finishes for printed circuit boards (PCB) in electronic packages.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads

Chi

Tsao

et al. 2007

J. of Materi Eng and Perform

View full text Add to dashboard Cite

show abstract

“…Also, when compared to the Sn-Pb eutectic solder, the Sn-58Bi eutectic solder offers a higher strength and superior creep resistance but a lower ductility. [5][6][7][8][9] During soldering, the solder alloy melts and then reacts with the substrate to form intermetallic compounds at the joint interface. The growth of interfacial reaction products through solid-state aging in solder joints is of particular interest to the electronics industry.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

2002

View full text Add to dashboard Cite

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 • C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energies of Cu 6 Sn 5 and Ni 3 Sn 4 intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.

show abstract

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

Cited by 119 publications

References 11 publications

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Contact Info

Product

Resources

About