2008
DOI: 10.1016/j.ijrmhm.2007.01.010
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The effect of deposition temperature on microstructure and properties of thermal CVD TiN coatings

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Cited by 73 publications
(32 citation statements)
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“…9. The hardness of TiN is a complex issue and comprises the elemental composition, defects, grain size, residual stress, and texture of the material [35]. The compressive stress in Ti layers decrease as the substrate temperature increases, whereas the tensile stress in TiN layers increases.…”
Section: Structural Analysismentioning
confidence: 99%
“…9. The hardness of TiN is a complex issue and comprises the elemental composition, defects, grain size, residual stress, and texture of the material [35]. The compressive stress in Ti layers decrease as the substrate temperature increases, whereas the tensile stress in TiN layers increases.…”
Section: Structural Analysismentioning
confidence: 99%
“…The growth rate, k, was calculated as described in Biira et al, 2017b). Apparent activation energy, which is a function of reactant concentration and temperature, can be used to determine the rate limiting growth mechanism (Kashani, Sohi and Kaypour, 2000;Wagner, Mitterer and Penoy, 2008). Therefore the two regimes on the Arrhenius plot might be a representation of surface reactions as the limiting mechanism between 1200°C and 1300°C, since apparent activation energy is high, nd mass transport mechanism for the substrate temperatures between 1300°C and 1600°C for the low apparent activation energy of 19.28 kJ/mol.…”
Section: Design and Fabrication Of A Chemical Vapour Deposition Systemmentioning
confidence: 99%
“…23) At present, (100), (111) and (110) are the three main orientations of TiN x films, 24,25) while the (211) orientation has also been obtained by several researchers using TiCl 4 precursor. 1,23,26) The orientation is the result of the competitive growth of differently oriented grains, and therefore the growth rate of grains, particularly those perpendicular to the surface, i.e., the deposition rate, would be closely related to the orientation. 1) In the present study, non-oriented TiN x films were prepared at R dep < 5 mmÁh À1 , whereas the orientation changed to (200) and then (111) orientation with increasing R dep (Fig.…”
Section: Preferred Orientationmentioning
confidence: 99%
“…1,2) In these applications, the control of the composition, microstructure and the preferred orientation is vital to determine the performance and lifetime of the coatings. 3) It is well known that the properties of TiN x films change with grain size, orientation and surface morphology, and that TiN x films with a (111) orientation have higher hardness than the films with a (200) orientation.…”
Section: Introductionmentioning
confidence: 99%