The Effect of Dielectric Height and Ground Plane Width on Multilayer MCM FGCPW Lumped Elements

Abstract

This paper investigates the effect of dielectric height and ground plane width on the performance of multilayer CPW transmission lines, lumped elements and circuits fabricated using photoimageable thick film technology. The effective dielectric constant and characteristic impedance are extracted to investigate the effect on transmission line dispersion. The equivalent circuit parameters for lumped elements are investigated for various dielectric thicknesses and ground plane widths. Finally, the practical effect of dielectric height is investigated for a 3GHz lumped element low pass filter.

Dielectric thickness and ground width effect on multilayer coplanar components and circuits for ceramic multichip modules

“…The straightforward and inexpensive photoimageable thick‐film technology provides a much finer line/gap resolution than the traditional PCB/thick‐film (including LTCC) process. The technology has been demonstrated as a suitable means of realizing low loss and compact lumped elements and various types' transmission lines, including FGCPW with initial results for different ground‐width and dielectric height [ 6, 7], a wide range of compact and high performance passive components up to 65 GHz [8, 9] and also a compact complete MCM receiver at 60 GHz [5]. Moreover, the technology is compatible with many fabrication process including LTCC and is being considered as a feasible approach for cost‐effective ceramic‐based microwave and mm‐wave ceramic MCM and system‐in‐package architecture realization [5, 10].…”