The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Mayappan, Ramani; Salleh, Amirah; Andas, Jeyashelly

doi:10.1063/1.4999878

Cited by 5 publications

(4 citation statements)

References 21 publications

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“…Solder is a material used for the interconnection in electronic circuits. Solder materials are becoming the crucial element in an electronic industry due to the concerns related to environment and health which are caused by the electronic waste [2]. Currently there are several promising solder materials such as Sn-Pb, Sn-Au, Sn-In, Sn-Ag, Sn-Zn, Sn-Bi and Sn-Ag-Cu [2].…”

Section: Introductionmentioning

confidence: 99%

“…Solder materials are becoming the crucial element in an electronic industry due to the concerns related to environment and health which are caused by the electronic waste [2]. Currently there are several promising solder materials such as Sn-Pb, Sn-Au, Sn-In, Sn-Ag, Sn-Zn, Sn-Bi and Sn-Ag-Cu [2]. In addition, these alloys exhibit important parameters like lower melting point and better mechanical properties and lack of hazardous whiskers in the solder joint.…”

Section: Introductionmentioning

confidence: 99%

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Soldering of copper using graphene-phosphoric acid gel

Puranik¹,

Sarkar

Gurumurthy

et al. 2020

J Met Mater Miner

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Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260℃. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Soldering of copper using graphene-phosphoric acid gel

Puranik¹,

Sarkar

Gurumurthy

et al. 2020

J Met Mater Miner

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“…Hence, surface diffusion of the intermetallic was suppressed by the graphene nanosheets because of their high barrier against diffusion of metal atoms (Liu et al , 2013; Kong et al , 2006; Gan et al , 2008). In previous studies (Mayappan and Salleh, 2017; Mayappan et al , 2017), the addition of graphene into Sn-3.5Ag solder suppressed the intermetallic growth.…”

Section: Introductionmentioning

confidence: 82%

Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

Mayappan

Salleh

Tokiran

et al. 2019

SSMT

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Purpose The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based solders play an important role in a variety of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces some reliability problems because of the formation of the thick intermetallic compounds. So the retardation of intermetallic growth is prime important. Design/methodology/approach The solder joint was aged under liquid state aging with soldering time from 1 to 60 min. Findings Two types of intermetallics, which are Cu6Sn5 and Cu3Sn were observed under a scanning electron microscope. The morphology of Cu6Sn5 intermetallic transformed from scallop to planar type as the soldering time increases. The addition of carbon nanotube into the SAC solder has retarded the Cu6Sn5 intermetallic growth rate by increasing its activation energy from 97.86 to 101.45 kJ/mol. Furthermore, the activation energy for the Cu3Sn growth has increased from 102.10 to 104.23 kJ/mol. Originality/value The increase in the activation energy indicates that the growth of the intermetallics was slower. This implies that the addition of carbon nanotube increases the reliability of the solder joint and are suitable for microelectronics applications.

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“…The aim of adding new materials to Sn is to observe the effect on the physical, electrical, magnetic and superconducting properties. Graphene is a single monolayer of carbon atoms with a hexagonal honeycomb structure that gives rise to superb electron mobility, thermal conductivity and high mechanical strength [10]. Sn-AgCu solder alloys were considered as one of the most promising lead-free solders, as they have a good reliability and mechanical properties [11].…”

Section: Introductionmentioning

confidence: 99%

Demonstration of better superconducting performance in a solder with low lead content

Aksoy¹,

Çakır²,

Koparan³

et al. 2022

Supercond. Sci. Technol.

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Lead-free SnIn solders are promising for superconducting magnet applications. However, their superconducting properties are not as good as lead solders. In order to improve the superconducting performance of the Sn-In solders, researchers have investigated the superconducting properties of ternary systems such as Sn-In-Bi for solder joints. In this study, powders of Pb, Nb, AgCu and grapheme nano pellets in ratios 0.5-5 wt % have been added into SnIn (35:65) to investigate their microstructural, thermal and superconducting properties. The added materials enhanced the superconducting properties. We find that even low Pb additions showed a dramatic improvement in superconducting properties, with an increase in both Tc and Jc values up to 6.35 K and 1.47×104 A/m2, respectively. This shows that much lower Pb content superconducting solders can be effective and could be used to replace the PbBi solder commonly used with the superconducting properties Tc = 8.4K, HC2 = 1.77 T, HC = 0.0909 T.

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The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Cited by 5 publications

References 21 publications

Soldering of copper using graphene-phosphoric acid gel

Soldering of copper using graphene-phosphoric acid gel

Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

Demonstration of better superconducting performance in a solder with low lead content

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