The effect of particle size on the densification kinetics of tungsten powder during spark plasma sintering

Deng, Shenghua; Li, Jianan; Li, Ruidi; Zhao, Hongjin; Yuan, Tiechui; Li, Lanbo; Zhang, Yingjie

doi:10.1016/j.ijrmhm.2020.105358

Cited by 22 publications

(3 citation statements)

References 30 publications

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“…These samples underwent significant shrinkage (Figure ), with more significant shrinkage and color fading for samples sintered at 800 °C. Densification of these samples due to particle size growth was confirmed by measuring the sample densities after these different postprocessing temperatures, with determined densities of 2.39 g mL –1 (air-dried); 2.32 g mL –1 (400 °C); 2,47 g mL –1 (600 °C); and 3.64 g mL –1 (800 °C). Importantly, all sintered samples retained their shape and did not crack.…”

Section: Resultsmentioning

confidence: 96%

Polymer-Assisted 3D Printing of Inductor Cores

Luo,

Yue,

et al. 2024

ACS Appl. Mater. Interfaces

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Poly(glycerol monomethacrylate) (PGMA) prepared by reversible addition−fragmentation chain transfer polymerization was investigated as an additive for high-loading iron oxide nanoparticle (IOP) 3D printable inks. The effect of adjusting the molar mass and loading of PGMA on the rheology of IOP suspensions was investigated, and an optimized ink formulation containing 70% w/w IOPs and 0.25% w/w PGMA 98 at pH 10 was developed. This ink was successfully 3D printed onto various substrates and into several structures, including rectangles, high aspect ratio cylinders, letters, spiral-and comb-shaped structures, and thin-and thick-walled toroids. The effect of sintering on the mechanical properties of printed artifacts was investigated via four-point flexural and compressive testing, with higher sintering temperatures resulting in improved mechanical properties due to changes in the particle size and microstructure. The printed toroids were fabricated into inductors, and their electrical performance was assessed via impedance spectroscopy at a working frequency range of 0.001−13 MHz. There was a clear trade-off between electrical properties and sintering temperature due to a phase change between γ-Fe 2 O 3 and α-Fe 2 O 3 upon heating. Nevertheless, the optimized devices had a Q factor of ∼40 at 10 MHz, representing a superior performance compared to that of other inductors with iron oxide cores previously reported. Thus, this report represents a significant step toward the development of low-cost, fully aqueous, high loading, and 3D printable ceramic inks for high-performance inductors and functional devices.

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Section: Resultsmentioning

confidence: 96%

Polymer-Assisted 3D Printing of Inductor Cores

Luo,

Yue,

et al. 2024

ACS Appl. Mater. Interfaces

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“…It is known that the pressure sintering of Si 3 N 4 based ceramics is a process at intermediate temperatures (1750 °C) [16]. Therefore, the densification process of Si 3 N 4 -CeO 2 powder in the intermediate sintering stage can be described by the creep model [17,18]:…”

Section: Densification Kinetics Of Si 3 N 4 Ceramics During Spsmentioning

confidence: 99%

Densification mechanism and microstructural evolution of Si₃N₄ composites with CeO₂ as additives during spark plasma sintering

Zhan,

Zhang,

Zhang

et al. 2024

Mater. Res. Express

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The densification mechanism of CeO2 doped Si3N4 ceramics during spark plasma sintering (SPS) was investigated. The sintering process was observed to undergo significant densification at the intermediate stage of sintering (1435 °C–1816 °C), and the density and grain size of CeO2 doped Si3N4 ceramic were found to be greater than those of pure Si3N4 ceramic under the same sintering conditions. To determine the densification mechanism, a creep model was utilized to determine the densification mechanism which could be interpreted based on the values of the stress exponent (n) and the apparent activation energy (Q d). The results revealed that the Q d of pure Si3N4 (381.15 kJ mol−1) is higher than that of Si3N4-CeO2 powder (265.61 kJ mol−1). Moreover, the stress exponent n of Si3N4-CeO2 powder (1.12–1.33) was higher than that of pure Si3N4 powder (1.00–1.18). This can be attributed to the fact that the addition of CeO2 resulted in the formation of a liquid phase at the grain boundary which leading to a shift in the controlling mechanism from grain boundary diffusion to grain boundary sliding.

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“…Additionally, a shorter geometrical ratio improved packing density and reduced pore size, leading to an increase in the effective cross‐sectional area available for load‐bearing. [ 24 ] Therefore, the densification rate was inversely proportional to ratios. The relationship between the densification rate ( n ) and the geometric parameters is depicted in Figure , which is linearly tuned as follows:

n = - 534.21 (R {normald}_{i} \times \frac{V}{l_t \times l_w}) + 2.674

…”

Section: A Modeling and Simulation Approach For Die Compactionmentioning

confidence: 99%

Analysis of Die Compaction of Chip Geometry through Porous Continuum Model‐Based Approach

Lee,

Kwon,

Kwon

et al. 2023

Adv Eng Mater

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Metal swarf has the advantage of being eco‐friendly due to their ability to be recycled and reused, in addition to being lightweight, energy‐absorbing, and cost‐effective. For practical applications in various industrial fields, effective and accurate modeling for each case should be developed in consideration of its physical properties. This study investigates the mechanical behavior of aluminum chip compaction employing a new computational simulation approach based on a pressure‐dependent porous continuum model. Two material parameters of densification rate (n) and ratio of shear modulus (m) were proposed and adjusted for different swarf. The numerical results show good agreement with the experimentally obtained axial stress – relative density relation of three various samples, demonstrating a close relationship between the parameters n and the chip geometry. This study can be applied for further investigation and analysis utilizing metal swarf of different geometries in various industrial applications.This article is protected by copyright. All rights reserved.

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The effect of particle size on the densification kinetics of tungsten powder during spark plasma sintering

Cited by 22 publications

References 30 publications

Polymer-Assisted 3D Printing of Inductor Cores

Polymer-Assisted 3D Printing of Inductor Cores

Densification mechanism and microstructural evolution of Si₃N₄ composites with CeO₂ as additives during spark plasma sintering

Analysis of Die Compaction of Chip Geometry through Porous Continuum Model‐Based Approach

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The effect of particle size on the densification kinetics of tungsten powder during spark plasma sintering

Cited by 22 publications

References 30 publications

Polymer-Assisted 3D Printing of Inductor Cores

Polymer-Assisted 3D Printing of Inductor Cores

Densification mechanism and microstructural evolution of Si3N4 composites with CeO2 as additives during spark plasma sintering

Analysis of Die Compaction of Chip Geometry through Porous Continuum Model‐Based Approach

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Product

Resources

About

Densification mechanism and microstructural evolution of Si₃N₄ composites with CeO₂ as additives during spark plasma sintering