The effect of Pd and Cu in the intermetallic growth of alloy Au wire

Chang, Hsihui; Hsieh, Ker-Chang; Martens, Theo; Yang, A.

doi:10.1007/s11664-003-0009-2

Cited by 26 publications

(19 citation statements)

References 2 publications

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“…Au-Al IMC formation using Au-1wt.%Pd wire was investigated, and the formation of a Pd-rich layer on Au/Al IMC layers was reported. 9 To identify the phase changes, wavelengthdispersive spectroscopy was used and final IMC phases were Au 5 Al 2 and Au 4 Al. 9 However, the Pd effect on Au-Al IMC formation was not explained.…”

Section: Introductionmentioning

confidence: 99%

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Kim

Cho

Park

et al. 2004

Journal of Elec Materi

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The main purposes for developing low-alloyed Au bonding wires were to increase wire stiffness and to control the wire loop profile and heat-affected zone length. For these reasons, many alloying elements have been used for the various Au bonding wires. Although there have been many studies reported on wire strengthening mechanisms by adding alloying elements, few studies were performed on their effects on Au bonding wires and Al pad interfacial reactions. Palladium has been used as one of the important alloying elements of Au bonding wires. In this study, Au-1wt.%Pd wire was used to make Au stud bumps on Al pads, and effects of Pd on Au/Al interfacial reactions, at 150°C, 175°C, and 200°C for 0 to 1200 h thermal aging, were investigated. Crosssectional scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), and electron probe microanalysis (EPMA) were performed to identify intermetallic compound (IMC) phases and Pd behavior at the Au/Al bonding interface. According to experimental results, the dominant IMC was Au 5 Al 2 , and a Pd-rich layer was at the Au wire and Au-Al IMC. Moreover, Au-Al interfacial reactions were significantly affected by the Pd-rich layer. Finally, bump shear tests were performed to investigate the effects of Pd-rich layers on Au wire bond reliability, and there were three different failure modes. Cracks, accompanied with IMC growth, formed above a Pd-rich layer. Furthermore, in longer aging times, fracture occurred along the crack, which propagated from the edges of a bonding interface to the center along a Pd-rich layer.

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Section: Introductionmentioning

confidence: 99%

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Kim

Cho

Park

et al. 2004

Journal of Elec Materi

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“…10 shows the microstructure of the Au-0.9Pd wire sample under 165°C and 3,000-h aging [1]. The (Au, Pd) 4 Al and Au 5 Al 2 (as Au 8 Al 3 ) phases tangled with the Pd-rich layer as α(Au, Pd).…”

Section: Discussionmentioning

confidence: 99%

“…However, the stiffness of gold wires must be enhanced to avoid short circuits caused by wire sweep. Au-Pd alloy wires (such as the Au-1 wt% Pd alloy wire) are one of the several alloy bonding wires that have been recently developed [1]. The bonding wire reacts with the Al pad and forms intermetallic phases to maintain the electrical connection.…”

Section: Introductionmentioning

confidence: 99%

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Phase diagram of Au–Al–Pd at 500 °C

et al. 2014

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The isothermal phase diagram of Au-Al-Pd at 500°C was constructed using diffusion couples and equilibrated bulk alloys. Electron microprobe analyses were used to determine the phase compositions and phase relationships. Thirteen three-phase equilibria and two ternary phases (T 1 and T 2 ) were identified in this study. Phase T 1 contained 37 at% Au, 26 at% Pd, and 37 at% Al. Phase T 2 contained 44 at% Au, 24 at% Pd, and 32 at% Al. The Au solubility in the Al 3 Pd 2 , AlPd, and AlPd 2 phases were 6, 15, and 34 at%, respectively. The Pd solubility in the AuAl

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“…A low-temperature Au-Al-Cu phase diagram could provide essential information to understand the reactions between the Au-Cu alloy wire and the Al pad. The stability of intermetallic phases is closely related to the reliability of wire bonding [1,2].…”

Section: Introductionmentioning

confidence: 99%

Phase diagram of Au-Al-Cu at 500 °C

et al. 2014

Gold Bull

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Diffusion couples and equilibrated alloys were used to construct the isothermal phase diagram of Au-Al-Cu at 500°C. Electron microprobe analyses were performed to determine the phase compositions and phase relationships. Two ternary phases and 10 three-phase equilibriums were determined in this study. Four additional three-phase equilibriums were estimated to meet the criteria for phase relationships. The δ (Au 2 Al) phase exhibited a wide range of solubility, and the lattice parameters were examined by X-ray. The solubility ranges of the binary intermetallic phases were also determined.

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The effect of Pd and Cu in the intermetallic growth of alloy Au wire

Cited by 26 publications

References 2 publications

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

Phase diagram of Au–Al–Pd at 500 °C

Phase diagram of Au-Al-Cu at 500 °C

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