The effect of solder paste composition on the reliability of SnAgCu joints

Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes

“…The original object and the pad of PCB are made to perform eutectic bonding to become a commonly seen electronic product. (c) Soldering [10,11,20,21]: This is a soldering way at the solder joint formed between the solder paste on the PCB, with chip mounting completed by SMD, being melted in reflow oven and the metal of SMD, without adding any extra soldering materials in the soldering process. The entire soldering process contains 4 main zones: (1) preheating zone; (2) activating zone; (3) heating zone; and (4) cooling zone.…”

“…This kind of compound formed on the interface between soldering tin and the metals of base material is called IMC. As to whether an IMC is weak or strong is one of the main factors determining the cracking and damage of solder joint [1,5,11,13,18]. When the thickness of IMC is increased, the ratio of tensile strength to initial value will be decreased accordingly.…”

“…The principles of this experiment are that the judgment is based on the soldering strength between various metallic materials and the solder paste [10,11,20,21]. The proof items include put test, shear test, drop test, temperature cycle, dye test and cross-section [15].…”

In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

“…However, the toxicity of Pb prompted major industrialized countries to pass legislation to limit the application of Sn-Pb solders [3,4]. At present, near-ternary eutectic Sn-Ag-Cu (SAC) alloys are considered as lead-free standard alloys, because they have relatively low melting temperature (217 1C) and good wettability compared with the Sn-Ag binary eutectic alloy [5][6][7].…”

Wettability of Low Silver Content Lead-Free Solder Alloy

“…6) Little variations in the amount of silver can significantly affect the mechanical properties of that alloy since the concentration of those elements in a solder matrix is relatively small. 7) Indium content in solders can reduce its melting temperature. 8,9) In this study, wettability of Sn-xAg-0.7Cu-0.5In solder alloy were investigated by varying the quantity of Ag (x ¼ 0:1{0:5).…”