Wettability of Low Silver Content Lead-Free Solder Alloy

Dharma, I Gusti Bagus Budi; Shukor, Mohd Hamdi Abd; Ariga, Tadashi

doi:10.2320/matertrans.m2009024

Cited by 12 publications

(4 citation statements)

References 10 publications

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“…Optimization of HASL process will prevent this issue from happen [9]. Overall, oxidation and thin layer IMC diminish the solderability and follows the behaviour that low wetting time means good wettability and possess high wetting force [1,10].…”

Section: Resultsmentioning

confidence: 99%

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Sobri

Salleh

Ghazali

et al. 2015

AMM

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SN100C lead-free solder coating wettability on SN100C solder has been investigated on as soldered samples and exposed intermetallic compound (IMC). In addition, the effect of oxidation on its wettability has also been investigated. Oxidation layer on the coated copper surface was developed after 120 hours of exposure on as soldered samples and exposed IMC samples. GEN3 solderability test machine in globule mode was used to determine the wettability of each sample. The influence of oxidation and the effect of exposed IMC were established. Results show that oxidation affected wettability by increasing the wetting time. On the other hand, exposed IMC had increased the wetting time and decreased the maximum force.

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Section: Resultsmentioning

confidence: 99%

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Sobri

Salleh

Ghazali

et al. 2015

AMM

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“…Also, if the liquid phase wets the grain boundaries, the electrical conductivity of the grain boundaries could be greatly enhanced, by a surface film rather than only point contacts due to discrete Ag NP or Ag particles, as was suggested by Zhao et al [8]. A similar binary and ternary eutectic in lead-free Sn-Ag-Cu solders aids in wetting the surfaces of electrical wires, pins, or pads [41,42].…”

Section: Sintering Behavior Changes and Scavenging Of Sbmentioning

confidence: 91%

Influence of silver nanoparticle addition, porosity, and processing technique on the mechanical properties of Ba0.3Co4Sb12 skutterudites

et al. 2014

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The thermoelectric skutterudite Ba 0.3 Co 4 Sb 12 is a promising candidate for waste heat recovery applications. Recently, it was demonstrated that the addition of silver nanoparticles (Ag NP ) to Ba 0.3 Co 4 Sb 12 increases both the thermoelectric figure of merit and electrical conductivity. This study is the first to examine the effect of Ag NP addition on the material's mechanical properties. This study also found that the Young's modulus, E, shear modulus, G, and bulk modulus, B, decreased linearly with increasing volume fraction porosity, P. Resonant ultrasound spectroscopy was employed to measure the elastic moduli, and Vickers indentation was used to determine the hardness, H, and fracture toughness, K C . Trends in the mechanical properties as a function of grain size, porosity, and the Ag NP are discussed in terms of the pertinent literature. While K C was independent of Ag NP addition, porosity, and grain size, both E and H decreased linearly with increasing porosity. In addition, this study is the first to identify (i) the Ag 3 Sb phase formed and (ii) the enhanced densification that occurs when the Ag NP is sintered with Ba 0.3 Co 4 Sb 12 powders, where both effects are consistent with the eutectic and peritectic reactions observed in the binary phase diagram Ag-Sb. These eutectic/peritectic reactions may also be linked to the enhancement of electrical conductivity previously observed when Ag is added to Ba 0.3 Co 4 Sb 12 . Also, similar beneficial eutectic/peritectic reactions may be available for other systems where conductive particles are added to other antimonides or other thermoelectric systems.

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“…1c shows a typical wetting balance curve. In this force-time curve, there are two most common values used as the wettability parameters: the wetting time (t 0 ) and the maximum wetting force (F max ) [18]. The time at which the solder contact angle to the specimen is 90°, or for the measured wetting force to return to zero are widely used as the wetting time.…”

Section: Methodsmentioning

confidence: 99%

Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

Sabri

Said

Shnawah

2015

Procedia Technology

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In this work, we investigate the effects of 0.1 and 0.5 wt.% Al additions on the wettability of Sn-1Ag-0.5Cu solder on a Cu substrate. Spread area and wetting balance methods were used to evaluate the wettability of the solders. The results of both tests show that the addition of 0.1 wt.% Al does slightly improve the wetting properties of the Sn-1Ag-0.5Cu solder, whereas the addition of 0.5 wt.% Al worsens the wetting properties.

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Wettability of Low Silver Content Lead-Free Solder Alloy

Cited by 12 publications

References 10 publications

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

Influence of silver nanoparticle addition, porosity, and processing technique on the mechanical properties of Ba0.3Co4Sb12 skutterudites

Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

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