2018
DOI: 10.1134/s1063785018110020
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The Effect of the Fin Shape and Thickness of the Buried Oxide on the DIBL Effect in an SOI FinFET

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Cited by 5 publications
(2 citation statements)
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“…At scaling MOS transistors, various degradation effects occur. Among them, there are short-channel effects [1,2], effects leading to a decrease the reliability of the transistor [3], the self-heating effect [4], and an increase in the sensitivity of various characteristics to the trapping of a single charge in the gate dielectric layer or at the gate dielectric-channel, which leads to the phenomenon of random telegraph noise in the drain current [5]. In addition, nanometer fin transistors, dimensional deviations leading to a change in the shape of the channel [6] can be observed.…”
mentioning
confidence: 99%
“…At scaling MOS transistors, various degradation effects occur. Among them, there are short-channel effects [1,2], effects leading to a decrease the reliability of the transistor [3], the self-heating effect [4], and an increase in the sensitivity of various characteristics to the trapping of a single charge in the gate dielectric layer or at the gate dielectric-channel, which leads to the phenomenon of random telegraph noise in the drain current [5]. In addition, nanometer fin transistors, dimensional deviations leading to a change in the shape of the channel [6] can be observed.…”
mentioning
confidence: 99%
“…However, these fluctuations can lead to significant variation of the transistor parameters and characteristics. In particular, it was established [12][13][14] that variations of the characteristics, parameters, and short-channel effects depend on the cannel (fin) shape and dimensions of FinFETs operating in the inversion mode.…”
mentioning
confidence: 99%