This article introduces a simple
method to selectively fabricate
conductive lines with good adhesion and outstanding electrical properties
on the surface of the polyethylene terephthalate (PET) film with simple
pre-treatment. The synthetic Pd2+ complex solution is selectively
coated on the surface of PET to establish a bridging layer by an inkjet
printing instrument. The bridging layer then catalyzes the electroless
deposition of copper after plasma activation. The deposited copper
coating and the bridging layer are characterized by X-ray photoelectron
spectroscopy, atomic force microscopy, contact angle, and scanning
electron microscopy. The results indicate that the bridging layer
is activated and reformed into a network structure after air plasma
treatment. The activated bridging layer effectively catalyzes the
electroless deposition of copper. An even and compact surface is achieved
in the as-prepared copper plating layer with 5B-level adhesion. In
addition, the electrical resistivity of selectively deposited copper
circuit is 2.26 μΩ/cm, which is equivalent to 1.3 times
of the bulk copper.