2017
DOI: 10.1007/s10853-017-1791-1
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The effects of argon and helium dilution in the growth of nc-Si:H thin films by plasma-enhanced chemical vapor deposition

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Cited by 14 publications
(3 citation statements)
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“…The growth mechanism of Si QD-based thin lm prepared by the way of PECVD in-situ deposition has been intensively studied, and the effect of dilution gas on lm growth have been clearly clari ed [31][32][33] .…”
Section: Discussionmentioning
confidence: 99%
“…The growth mechanism of Si QD-based thin lm prepared by the way of PECVD in-situ deposition has been intensively studied, and the effect of dilution gas on lm growth have been clearly clari ed [31][32][33] .…”
Section: Discussionmentioning
confidence: 99%
“…During the film growth process, plasma power and chamber pressure were maintained at 260 W and 0.4 Torr, respectively. H 2 as a diluent in plasma was used to initiate a rapid nanocrystallization, while He was used to facilitate a higher deposition rate at a lower power and also to maintain a lower ion energy at the growth zone. ,, The presence of CO 2 in plasma introduced the oxygenated network; however, an increased flow rate of CO 2 was used to transform the network from nanocrystalline to an amorphous-dominated structure …”
Section: Methodsmentioning
confidence: 99%
“…As for PECVD route, various dilution gases, such as H 2 , He, Xe and Ar, are introduced for diluting precursor gases and creating high-density plasma [10][11][12]. Thereinto H 2 has the effect on prompting the crystallization of as-deposited Si-based thin films, while deposition rate and doping efficiency are possible to be effectively improved in Ar plasma due to the metastable state Ar * .…”
Section: Introductionmentioning
confidence: 99%