The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive

Cai, Xiong‐hui; Chen, Xian-cai; An, Bing; Wu, Fengshun; Wu, Yiping

doi:10.1109/icept.2009.5270585

Cited by 9 publications

(5 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In consequence, its stiffness increased, which resulted in higher shear force. The results obtained were consistent with the investigations made by Cai et al (2009) and Rizvi et al (2005). The curing temperature had the same effect on the shear force.…”

Section: Discussionsupporting

confidence: 91%

Mechanical durability of RFID chip joints assembled on flexible substrates

Janeczek

Serzysko

Jakubowska

et al. 2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to investigate the durability of radio-frequency identification (RFID) chips assembled on flexible substrates (paper and foil), with materials evaluated with regard to mechanical stresses and dependence on the applied substrate, antenna materials, chip pad printing and chip encapsulation. Design/methodology/approach -RFID chips were assembled to antennas screen printed on flexible substrates. Shear and bending tests were conducted in order to evaluate the mechanical durability of the chip joints depending on the materials used for mounting the RFID chip structures. X-ray inspection and cross sectioning were performed to verify the quality of the assembly process. The microstructure and the resistance of the materials used for chip pads were investigated with the aim of determining the conductivity mechanism in the printed layers. Findings -Addition of carbon nanotubes to the conductive adhesive (CA) provided a higher shear force for the assembled RFID chips, compared to the unmodified conductive adhesive or a polymer paste with silver flakes. However, this additive resulted in an increase in the material's resistance. It was found that the RFID substrate material had a significant influence on the shear force of mounted chips, contrary to the materials used for printing antennas. The lower shear force for chips assembled on antennas printed on paper rather than on foil was probably connected with its higher absorption of solvent from the pastes. Increasing the curing temperature and time resulted in an additional increase in the shear force for chips assembled to antennas printed on foil. A reverse dependence was observed for chips mounted on the antennas made on paper. An improvement in the durability of the RFID chip structures was achieved by chip encapsulation. Bending tests showed that a low-melting adhesive was the best candidate for encapsulation, as it provided flexibility of the assembled structure. Research limitations/implications -Further studies are necessary to investigate the mechanical durability of RFID chips assembled with a conductive adhesive, with different addition levels and types of carbon nanotubes. Practical implications -The results revealed that the best candidate for providing the highest RFID chip durability related to mechanical stresses was the low-melting adhesive. It can be recommended for practical use, as it simplified the assembly process and reduced the curing step in the encapsulation of the RFID devices. From the results of shear testing, conductive adhesives with carbon nanotubes can be used in RFID chip assembly because of their ability to increase the shear force of joints created between the antenna and the chip. Originality/value -In this paper, the influence of the materials used for antenna, chip pads, encapsulation and the curing conditions on the mechanical durability (shear and bending) of RFID chips was analyzed. Commercial and elaborated materials were compared. Some new materials containing a conductive adhesive and carbon ...

show abstract

Section: Discussionsupporting

confidence: 91%

Mechanical durability of RFID chip joints assembled on flexible substrates

Janeczek

Serzysko

Jakubowska

et al. 2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…For instance, low degree of cure may expose ACA matrix to relaxation and creep, which may lead to open joints as conductive particles lose contact with the contacts on the substrates. Furthermore, less cured adhesives are susceptible to moisture absorption and swelling caused by it [19], [20]. As ACA joints are often used in environments where they are exposed to humidity, this may cause critical reliability problems compared to joints having properly cured adhesives.…”

Section: B Results Of the Peel Strength Testmentioning

confidence: 99%

The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples

Kiilunen

Frisk

Hoikkanen

2012

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

Today, flex-on-board (FOB) attachments are commonly used in a variety of applications. By using anisotropically conductive adhesives (ACAs), low-cost flex materials that could not withstand typical soldering temperatures can be utilized. This paper examines the effect of manufacturing process parameters on the peel strength of a FOB assembly with an ACA attachment. The effects of bonding time and temperature on the curing properties of the ACA were also studied. The mechanical strength of the assembly was studied using a 90 • peel strength test. The results showed that, by elevating curing temperature, better peel test results were obtained due to the higher degree of cure of the ACA. Additionally, longer curing time increased the peel strength. However, it also caused a considerably higher deviation in the results. Failure analysis using scanning electron microscopy showed that, with a higher degree of curing, the failure location in the peel strength test changed from the flex-adhesive interface toward the adhesive-substrate interface.Index Terms-Anisotropically conductive adhesive (ACA), flex-on-board (FOB), peel strength.

show abstract

“…ACF flip chip applications do not need additional underfill, and they have a fine pitch capability [ 13 ]. Anisotropically conductive adhesives are used, for example, in radio-frequency identification (RFID) tags [ 14 ], in liquid crystal displays (LCD) [ 15 ], and memory chips [ 16 ] in mobile applications as well as in various fine-pitch applications [ 17 ]. ACFs are also suitable for many different sensor applications.…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Storage Testing of ACF Attached Sensor Structures

et al. 2015

View full text Add to dashboard Cite

Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readily available than traditional materials. Thus, there is an increasing interest in using low-cost polymer materials in high temperature applications. This paper studies the performance and reliability of sensor structures attached with anisotropically conductive adhesive film (ACF) on two different organic printed circuit board (PCB) materials: FR-4 and Rogers. The test samples were aged at 200 °C and 240 °C and monitored electrically during the test. Material characterization techniques were also used to analyze the behavior of the materials. Rogers PCB was observed to be more stable at high temperatures in spite of degradation observed, especially during the first 120 h of aging. The electrical reliability was very good with Rogers. At 200 °C, the failures occurred after 2000 h of testing, and even at 240 °C the interconnections were functional for 400 h. The study indicates that, even though these ACFs were not designed for use in high temperatures, with stable PCB material they are promising interconnection materials at elevated temperatures, especially at 200 °C. However, the fragility of the structure due to material degradation may cause reliability problems in long-term high temperature exposure.

show abstract

The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive

Cited by 9 publications

References 3 publications

Mechanical durability of RFID chip joints assembled on flexible substrates

Mechanical durability of RFID chip joints assembled on flexible substrates

The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples

High-Temperature Storage Testing of ACF Attached Sensor Structures

Contact Info

Product

Resources

About