Further performance improvement in Nb 3 Sn conductors is strongly demanded towards realization of upcoming high eld magnet applications such as the Future Circular Collider FCC and the DEMOnstration power plant DEMO . However, we are facing the problem that the J c performance of the Nb 3 Sn strands are almost fully optimized in terms of Nb/Cu/Sn area ratio, cross sectional design, Nb lament diameter, and so on. We thus need some breakthrough to overcome the problem. In this context, we have been studying the new microstructure control by the element addition into the Cu matrix of the internal tin processed Nb 3 Sn conductors. In this paper, some results of the more fundamental study on the effect of the Zn addition are reported. In addition, results of the simultaneous addition of Zn and a small amount of Mg, and the in uence of Ti doping position on the microstructure and J c performance are reported. It was found that signi cantly different diffusion behaviors happen in the Cu Zn/Sn diffusion reaction. For instance, in the Cu Zn/Sn diffusion, a solid ternary Cu Sn Zn phase widely forms at the outermost reaction front at 400 heat treatment, whereas the porous ε phase widely forms in the Cu/Sn diffusion. A small addition of Mg into the brass matrix resulted in ner grain size and better J c performance. Ti doping to the Nb laments but not Sn cores leads to elimination of Ti rich layer at the boundary that forms in Ti doping to Sn cores. The absence of Ti rich layer contributes signi cantly to improvement of Sn and Ti distribution across the cross section.