The Effects of micro Aluminum fillers In Epoxy resin on the thermal conductivity

Jasim, Kareem A.; Fadhil, Rihab Nassr

doi:10.1088/1742-6596/1003/1/012082

Cited by 17 publications

(10 citation statements)

References 5 publications

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“…The study aims at conducting the process of preparing the alloy with the chemical formula Se60Te40-xSnx with different concentrations of Sn (0, 5,10,15,20) by melting point method. The chemical elements Se, Te, and Sn were taken at high purity (99.999%).…”

Section: Methodsmentioning

confidence: 99%

“…Chalcogenide glasses consist of chalcogen elements from the sixth group of elements of the periodic table [4]. Chalcogenide glasses are considered one of the most promising materials in the modern era due to their live technological applications [5] and commercial importance [6]. The present work is based on a tin-containing (Se-Te) glass system as a third alternative.…”

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confidence: 99%

“…Figure9. electrical resistance as a function of temperature of of the Se60Te40-xSnx glass system (x = 0,5,10,15,20) …”

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confidence: 99%

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A Study of the Effectiveness of Tin on the Thermal Conductivity Coefficient and Electrical Resistance of Se60Te40-xSnx Chalcogenide Glass

Khudhair

Jasim

2023

IHJPAS

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This research calculated the effect of partial replacement of Trillium with tin by weight ratios x=0, 5, 10, 15, and 20 of the weight of manufactured samples on the thermal conductivity coefficient of Se60Te40-xSnx chalcogenide glasses. The thermal conductivity coefficient of the samples was calculated using a disk- Lee. The results showed that increasing the concentration of tin improves the thermal insulation ability by decreasing the thermal conductivity value and then determining the optimal weight ratios at which a large thermal insulation is obtained. The electrical resistivity as a function of temperature was studied. The electrical resistivity (rd.c) was calculated as a function of temperature for all samples, using two-point probe techniques in the dark electrical resistivity measurements of Se60Te40-xSnx glasses for all values made in the temperature range 303-455 K. The electrical resistivity was found that it depends on the change in Tin addition, the temperature is clearly affected by the increase in the concentration of tin in the alloy. The electrical resistance increases when the concentration of Tin increase of Se60Te40-xSnx

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Section: Methodsmentioning

confidence: 99%

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confidence: 99%

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A Study of the Effectiveness of Tin on the Thermal Conductivity Coefficient and Electrical Resistance of Se60Te40-xSnx Chalcogenide Glass

Khudhair

Jasim

2023

IHJPAS

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“…In response to this shortcoming, predecessors made an epoxy resin thermally conductive adhesive by adding various thermally conductive fillers. , The addition of a thermally conductive filler should be based on enhancing the thermal conductivity effect and improving the overall performance of the composite material. Thermally conductive fillers can be roughly divided into metal fillers based on Cu, Al, Zn, and alloys; , inorganic ceramic fillers mainly based on Al 2 O 3 , ZnO, BN, and SiC; − carbon fillers based on graphene, carbon nanotubes, carbon nanometers; and some composite fillers. , As a new type of thermal management material, the epoxy resin thermally conductive adhesive has been widely used in the heat dissipation process of electronic components. − It has superior thermal conductivity, which can effectively reduce the internal temperature of electronic components and improve the work efficiency and reliability of electronic components. However, while the thermal conductivity increases, the mechanical properties deteriorate due to the high amount of thermally conductive materials .…”

Section: Introductionmentioning

confidence: 99%

Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

Zhang,

Xu,

Huang

et al. 2024

ACS Omega

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An epoxy resin thermally conductive adhesive is a type of thermosetting polymer encapsulation material that exhibits comprehensive performance, and the thermomechanical properties of this adhesive vary significantly under different curing conditions. In this paper, spherical alumina was used as a filler for thermal conductivity to prepare an epoxy resin thermal conductivity adhesive using a multistage freezing mixing method. The effects of various curing conditions on the thermal− mechanical properties and fracture morphology of the epoxy resin thermal conductivity adhesive were studied. The results showed that the curing condition of 150 °C/2.5 h significantly improved the performance of the epoxy resin thermally conductive adhesive. Through the shear test of the composite material, the influence of the curing agent on the adhesion of the thermally conductive adhesive under fixed conditions was explored. It was found that the curing agent with a superbranched structure exhibited latent properties and greatly enhanced the toughness of the cured epoxy resin product. Altering the curing conditions increases the shear strength by up to 307%. With the increase in curing temperature and the extension of curing temperature, the glass transition temperature gradually increased from 103.9 to 159.8 °C. The initial decomposition temperature T IDT gradually increased from 295.4 to 310.1 °C, and the temperature at which the fastest decomposition rate occurs (T max ) gradually increased from 312.48 to 330.33 °C. The thermal stability of the substance increased with both temperature and time. The curing time and curing temperature were increased, and the morphology of the fracture of the epoxy resin thermally conductive adhesive cured sample gradually showed a ductile fracture from a typical brittle fracture. The research results reveal the influence of curing conditions on the thermal conductivity and thermal stability of the epoxy resin thermally conductive adhesive, which has a specific reference value for improving the performance of the epoxy resin thermally conductive adhesive, optimizing its usage conditions, and improving production efficiency.

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“…Therefore, usually only metal fillers with a relatively low density or small particle size can be directly added to thermosetting resins. For example, Kareem et al added lower-density aluminum powder with an average diameter of 7 μm to epoxy resin (45 wt %), and the thermal conductivity of the obtained composite material can reach 1.46 W/m·K. In addition, conductive silver paste widely used in the electronics industry is generally prepared with silver particles and epoxy glue as the main components. , In general, although the high thermal conductivity of metal fillers makes them have broad application prospects, there are few types that can be mixed with thermosetting resins at present.…”

Section: Introductionmentioning

confidence: 99%

Sepiolite Fiber Supports Tin Powder and Boron Nitride to Prepare Epoxy Composites with Insulation Properties and High Through-Plane Thermal Conductivity

Yang

Zhang

Yao

2022

ACS Appl. Electron. Mater.

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Metal fillers are not suitable for direct mixing and casting with thermosetting resins to prepare thermally conductive and insulating materials due to their high density and electrical conductivity. Here, we obtain a filter cake by mixing sepiolite fiber, tin powder, and h-BN through vacuum filtration. Low melting point tin particles are melted and allowed to infiltrate to fill the void defects around them after the filter cake is heat-treated, and the added h-BN will coat the tin particles to prevent them from coming into contact with each other to conduct electricity but does not hinder heat conduction. The test results show that when the tin powder content is about 47.2 wt %, the thermal conductivity can reach 3.37 W/m•K and the volume resistance is still greater than 10 9 Ω•m. This method provides an idea for the preparation of high thermal conductivity metal-thermosetting resin composite materials.

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The Effects of micro Aluminum fillers In Epoxy resin on the thermal conductivity

Cited by 17 publications

References 5 publications

A Study of the Effectiveness of Tin on the Thermal Conductivity Coefficient and Electrical Resistance of Se60Te40-xSnx Chalcogenide Glass

A Study of the Effectiveness of Tin on the Thermal Conductivity Coefficient and Electrical Resistance of Se60Te40-xSnx Chalcogenide Glass

Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

Sepiolite Fiber Supports Tin Powder and Boron Nitride to Prepare Epoxy Composites with Insulation Properties and High Through-Plane Thermal Conductivity

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