The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process

Zhao, Zhangjian; Shang, Jian Ku; Hu, Anmin; Li, Ming

doi:10.1016/j.matlet.2016.08.115

Cited by 13 publications

(1 citation statement)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the development of three-dimensional electronic packaging, the diameter of solder bumps on stacked chips is decreasing gradually from the current 100 mm to an expected 1 mm in the future (Hsiao et al , 2012). However, many studies have shown that reduction in solder ball size results in the formation of thicker interfacial IMC layers (Huang and Yang, 2014; Choi et al , 2002; Sharif et al , 2004; Zhao et al , 2016). This occurs even for slow-reacting systems such as Ni/Sn (Divya et al , 2017), further impacting joint reliability.…”

Section: Introductionmentioning

confidence: 99%

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Liu

et al. 2019

SSMT

View full text Add to dashboard Cite

Purpose This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples. Design/methodology/approach The Ni/Sn/Ni joints were obtained through ultrasonic-assisted soldering. The formation of IMCs, their composition, grain morphology and the fractured-surface microstructures from shear tests were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy. Findings Without USV, a planar interfacial Ni3Sn4 layer was formed at the Ni/Sn interface, and a few Ni3Sn4 grains were distributed in the soldered joint. The morphology of these grains was needle-shaped. With USV, several grooves were formed at the interfacial Ni3Sn4 layer due to ultrasonic cavitation. Some deepened grooves led to “neck” connections at the roots of the Ni3Sn4 grains, which accelerated the strong detachment of Ni3Sn4 from the substrate. In addition, two types of Ni3Sn4 grains, needle-shaped and granular-shaped, were observed at the interface. Furthermore, the shear strength increased with longer USV time, which was attributed to the thinning of the interfacial IMC layers and dispersion strengthening from the Ni3Sn4 particles distributed evenly in the joint. Originality/value The novelty of the paper is the detailed study of the effect of USV on the morphology, size changes of interfacial IMC and joint strength. This provides guidance for the application of ultrasonic-assisted soldering in electronics packaging.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Liu

et al. 2019

SSMT

View full text Add to dashboard Cite

show abstract

Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints

Cheng

2020

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu6Sn5

Jacobsson,

Hallberg,

Hektor

et al. 2024

Computational Materials Science

View full text Add to dashboard Cite

The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process

Cited by 13 publications

References 10 publications

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints

A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu6Sn5

Contact Info

Product

Resources

About