The effects of the SiOSi segment presence in BAPP/BPDA polyimide system on morphology and hardness properties for opto-electronic application

Othman, Muhammad Bisyrul Hafi; Ahmad, Zulkifli; Akil, Hazizan Md; Zakaria, Muhammad Razlan

doi:10.1016/j.matdes.2015.05.054

Cited by 19 publications

(8 citation statements)

References 30 publications

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“…The mechanism of HF dissolving silica particles in the polymer is known as the H+ ion of HF breaking the bond of SiOSi through chemical treatment . Silica oxide particles are typically etched by HF solution:

{SiO}_{2} + 4 HF \to {SiF}_{4} + {2 H}_{2} O .

…”

Section: Resultsmentioning

confidence: 99%

Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties

Yoo

Ghorpade

Kim

et al. 2017

J of Applied Polymer Sci

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In this study, 2,7‐diamino‐9‐fluorenol (DAF) has been introduced to bond silica to the main chain of the polyimide (PI) copolymer. DAF contains a hydroxyl group that could covalently bond with silica particles. 4,4′‐(Hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 4,4′‐oxydianiline (4,4′‐ODA) have been used as monomers to form a copolymer with DAF. The variation of silica content was controlled as 5%, 7.5, 10, 12.5 wt %. Variation in silica content contributes to the formation of various size (100–410 nm) of macroporous voids after hydrofluoric acid (HF) treatment. HF etching process was introduced to dissolve the silica and form voids in the structure of PI copolymer films. Compared with conventional PI films, air voids that were formed in the PI copolymer film reduced the dielectric from 4.40 to 1.86. The reduction in the dielectric constants can be explained in terms of creating silica particles that increase the presence of air voids after HF treatment. The thermal stability was stable up to 500 °C and the modulus change was confirmed with a dynamic mechanical analysis (DMA) to evaluate the effect of silica on thermal and mechanical properties. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 45982.

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{SiO}_{2} + 4 HF \to {SiF}_{4} + {2 H}_{2} O .

…”

Section: Resultsmentioning

confidence: 99%

Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties

Yoo

Ghorpade

Kim

et al. 2017

J of Applied Polymer Sci

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“…With the fast evolution of the microelectronics industry, the impact of the propagation velocity delay of the signal, crosstalk, and power dissipation on microelectronic performance is becoming increasingly apparent. [1][2][3] To address these shortcomings, it is critical to develop new interlayer insulation structure, and the side methyl group can significantly reduce the interaction between PI molecular chains, resulting in the improvement of solubility and melt processability (thermoplasticity) of PI films. Furthermore, the large fluorenyl cardo groups of BAFL greatly enhanced the rigidity of the molecular skeleton, which significantly increased the heat resistance of polyimide.…”

Section: Introductionmentioning

confidence: 99%

“…With the fast evolution of the microelectronics industry, the impact of the propagation velocity delay of the signal, cross‐talk, and power dissipation on microelectronic performance is becoming increasingly apparent. [ 1–3 ] To address these shortcomings, it is critical to develop new interlayer insulation materials with low dielectric constants (low‐ k ) and excellent comprehensive performance. Polyimides (PIs) are regarded as potential candidates for low‐ k interlayer dielectric materials due to their low dielectric constant, good thermal resistance, and excellent mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Achieving Hydrophobic Ultralow Dielectric Constant Polyimide Composites: Combined Efforts of Fluorination and Porous Fillers

Zhao

et al. 2022

Macro Materials & Eng

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The advancement of the microelectronics industry necessitates the use of interlayer insulation materials with low dielectric constants and high mechanical properties. In this paper, a new type of copolymerized fluorinated polyimide (PI) is synthesized, and mixed with polyhedral oligomeric silsesquioxane (POSS) functionalized mesoporous silica (MCM-41@POSS). The PI/MCM-41@POSS composites exhibit good hydrophobicity. With the addition of 3 wt% MCM-41@POSS, the PI composite attained an ultralow dielectric constant (k = 1.88) and low dielectric loss (0.01) at 1 MHz, which is attributed to the mesoporous structure of MCM-41 and the restriction of polarization in the bonded region. The decorated POSS effectively prevents the penetration of PI molecular chains into the mesopores of MCM-41. In addition, the PI composites containing 3 wt% of MCM-41@POSS obtain the highest maximum stress of 104.03 MPa with an elongation at break of 13.73%. The hydrophobic PI composites with ultralow-k are expected to be good candidates as interlayer materials in microelectronics devices.

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“…Free volume of the block copolymer is increased, leading to compromised hardness and enhanced flexibility. [23,24] Furthermore, a rigidness/softness coupling mechanism is introduced into the PSI binder to alleviate the adverse mechanical impact (Figure 1a, 1b). On one hand, the rigid PI block provides high modulus to withstand mechanical stress generated by lithiated silicon.…”

Section: Introductionmentioning

confidence: 99%

“…On one hand, the rigid PI block provides high modulus to withstand mechanical stress generated by lithiated silicon. [24,25] On the other hand, the soft siloxane component offers excellent elasticity to accommodate volume expansion via a reversible shape deformation. The elasticity of the PSI is enhanced compared to the PI binder, which is helpful to mitigate mechanical stress and restore deformation upon lithiation and delithiation.…”

Section: Introductionmentioning

confidence: 99%

Poly(siloxane imide) Binder for Silicon‐Based Lithium‐Ion Battery Anodes via Rigidness/Softness Coupling

Meng

Cheng

et al. 2020

Chemistry An Asian Journal

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Binders play a crucial role in maintaining mechanical integrity of electrodes in lithium‐ion batteries. However, the conventional binders lack proper elasticity, and they are not suitable for high‐performance silicon anodes featuring huge volume change during cycling. Herein, a poly(siloxane imide) copolymer (PSI) has been designed, synthesized, and utilized as a binder for silicon‐based anodes. A rigidness/softness coupling mechanism is demonstrated by the PSI binder, which can accommodate volume expansion of the silicon anode upon lithiation. The electrochemical performance in terms of cyclic stability and rate capability can be effectively improved with the PSI binder as demonstrated by a silicon nanoparticle anode.

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The effects of the SiOSi segment presence in BAPP/BPDA polyimide system on morphology and hardness properties for opto-electronic application

Cited by 19 publications

References 30 publications

Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties

Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties

Achieving Hydrophobic Ultralow Dielectric Constant Polyimide Composites: Combined Efforts of Fluorination and Porous Fillers

Poly(siloxane imide) Binder for Silicon‐Based Lithium‐Ion Battery Anodes via Rigidness/Softness Coupling

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