2012
DOI: 10.1088/1674-1056/21/4/047202
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The electrical properties of sulfur-implanted cubic boron nitride thin films

Abstract: Cubic boron nitride (c-BN) thin films are deposited on p-type Si wafers using radio frequency (RF) sputtering and then doped by implanting S ions. The implantation energy of the ions is 19 keV, and the implantation dose is between 10 15 ions/cm 2 and 10 16 ions/cm 2 . The doped c-BN thin films are then annealed at a temperature between 400 • C and 800 • C. The results show that the surface resistivity of doped and annealed c-BN thin films is lowered by two to three orders, and the activation energy of c-BN thi… Show more

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Cited by 8 publications
(4 citation statements)
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“…11,13,16 Although an activation energy of 0.18 eV was obtained by ion implantation of S followed by annealing at 400C, the cubic phase content was found to be less than 30%. 17 This paper addresses two critical challenges related to c-BN growth and doping with both n-and p-type dopants beyond the thermodynamic solid solubility limits. The first challenge has been addressed by the laser melting of nanocrystalline hexagonal boron nitride (h-BN) in a super undercooled state and rapid quenching subsequently.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…11,13,16 Although an activation energy of 0.18 eV was obtained by ion implantation of S followed by annealing at 400C, the cubic phase content was found to be less than 30%. 17 This paper addresses two critical challenges related to c-BN growth and doping with both n-and p-type dopants beyond the thermodynamic solid solubility limits. The first challenge has been addressed by the laser melting of nanocrystalline hexagonal boron nitride (h-BN) in a super undercooled state and rapid quenching subsequently.…”
Section: Introductionmentioning
confidence: 99%
“…The doping efficiency of n-type dopants in c-BN is another critical issue to be resolved for practical electronic device applications. Si is a very commonly used n-type dopant for c-BN, but the higher activation energies such as 1.17 eV for in situ Si cosputtered c-BN, 0.42 eV for high-temperature thermal annealed c-BN, and 0.4 eV for Si implanted c-BN even in heavily doped samples (3.3 atom %) make it very inefficient for practical applications. ,, Although an activation energy of 0.18 eV was obtained by ion implantation of S followed by annealing at 400C, the cubic phase content was found to be less than 30% …”
Section: Introductionmentioning
confidence: 99%
“…As an analog of diamond, cubic boron nitride (c-BN) exhibits many similar outstanding properties such as extreme hardness, wide band gap, negative electron affinity, high thermal conductivity, etc. [1][2][3][4][5][6][7][8][9][10][11][12] Furthermore, c-BN also holds numerous physical properties and chemical inertness, making it more superior to diamond for future technical applications. However, the nucleation and growth of c-BN film require the high-energy ion bombardment on the growing surface no matter whether physical vapor deposition (PVD) or chemical vapor deposition (CVD) method is used, resulting in accumulation of the compressive stress.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5] One of the promising application fields, which has long been expected, is to use the c-BN film as a protective coating for cutting tools, because it possesses outstanding mechanical properties such as high hardness, wear resistance, and chemical inertness to ferrous metals at high temperatures. [2][3][4][5][6] The films are always required to be thick enough in order to play a protective role. One of the great hurdles, which restricts its practical usage, is the high compressive stress and the poor adhesion to most of the substrates.…”
Section: Introductionmentioning
confidence: 99%