2002
DOI: 10.1016/s0168-583x(02)01273-9
|View full text |Cite
|
Sign up to set email alerts
|

The estimation of sputtering yields for SiC and Si

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
19
0

Year Published

2004
2004
2021
2021

Publication Types

Select...
8
1

Relationship

1
8

Authors

Journals

citations
Cited by 38 publications
(25 citation statements)
references
References 36 publications
2
19
0
Order By: Relevance
“…Determination of the sputtering depth is strictly connected with the number of atoms removed for each sputtering ion. The sputtering yield depends on the chemical state of the material being sputtered, ion current density, energy of incoming ions, type of noble gases and incidence angle of the sputtering ions as well as temperature [18,19]. It is well known that in the case of silicon for the same values of ion energy for noble gas ions, the sputter yield depends on the mass of noble gases e.g.…”
Section: Resultsmentioning
confidence: 99%
“…Determination of the sputtering depth is strictly connected with the number of atoms removed for each sputtering ion. The sputtering yield depends on the chemical state of the material being sputtered, ion current density, energy of incoming ions, type of noble gases and incidence angle of the sputtering ions as well as temperature [18,19]. It is well known that in the case of silicon for the same values of ion energy for noble gas ions, the sputter yield depends on the mass of noble gases e.g.…”
Section: Resultsmentioning
confidence: 99%
“…The T-DYN dynamic code, which is based on the trajectory of ions in matters ͑TRIM͒ code, can be used to simulate energetic atom displacement in solids. [19][20][21][22] T-DYN simulations were performed under conditions of ion impingement perpendicular to the surface of a semi-infinite medium consisting of cobalt, constant ion energy, and no Ar + ion implantation. Details of the computational algorithms of the T-DYN code can be found elsewhere.…”
Section: Monte Carlo Simulationsmentioning
confidence: 99%
“…To examine the validity of applying the potential to SiC etching, we calculated the sputtering yield of SiC by Ar shown in Table 1. In order to compare with the experimental data [22], the incident energies are 500 and 700 eV Ar and the incident angle is set to 30°with respect to surface plane. The data show that the sputtering yield obtained by our MD simulations is comparable to experimental data and that obtained from TRIM [22].…”
Section: Computational Descriptionsmentioning
confidence: 99%
“…In order to compare with the experimental data [22], the incident energies are 500 and 700 eV Ar and the incident angle is set to 30°with respect to surface plane. The data show that the sputtering yield obtained by our MD simulations is comparable to experimental data and that obtained from TRIM [22]. The Molière potential was used to describe interactions between Ar-C and Ar-Si [23].…”
Section: Computational Descriptionsmentioning
confidence: 99%