Proceedings of Topical Workshop on Electronics for Particle Physics — PoS(TWEPP2019) 2020
DOI: 10.22323/1.370.0022
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The first ASIC prototype of a 28 nm time-space front-end electronics for real-time tracking

Abstract: A front-end ASIC for 4D tracking is presented. The prototype includes the block necessary to build a pixel front-end chain for timing measurement, as independent circuits. The architecture includes a charge-sensitive amplifier, a discriminator with programmable threshold, and a timeto-digital converter. The blocks were designed with target specifications in mind including: an area occupation of 55 µm × 55 µm, a power consumption tens of micro ampere per channel and timing a resolution of at least 100 ps. The p… Show more

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Cited by 6 publications
(5 citation statements)
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“…It is desired for the system to have low mass for easier reconstruction, hence a lightweight cooling system would be needed. New advances in LGADs try to avoid inefficient gaps between to pixels and lead to better fill factor [19,20,21].…”
Section: Discussionmentioning
confidence: 99%
“…It is desired for the system to have low mass for easier reconstruction, hence a lightweight cooling system would be needed. New advances in LGADs try to avoid inefficient gaps between to pixels and lead to better fill factor [19,20,21].…”
Section: Discussionmentioning
confidence: 99%
“…Recent developments include the Timepix4 ASIC [57], a full size 4-side tileable chip with high rate imaging capabilities which has been successfully developed in 65 nm CMOS technology and provides a time stamp binning resolution of 195 ps (RMS 56 ps). The TIMESPOT demonstrator ASIC [58] is being developed in 28 nm CMOS technology and aims for ultimate time resolution using a CSA inverter input stage. The LHCb experiment plans a Phase II Upgrade [59], due for installation after LS4, which will require a high granularity pixel vertex detector capable of hit timestamps, operating at high speed in a high radiation environment.…”
Section: Solutions Based On Hybrid Pixel Sensorsmentioning
confidence: 99%
“…More details can be found in Ref. [18]. The chip will be bump-bonded to silicon and diamond 3D pixel detectors by IZM (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Germany) and subsequently tested at a particle beam.…”
Section: Fabrication Of New Sensorsmentioning
confidence: 99%