2018
DOI: 10.1016/j.compositesa.2018.01.002
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The formation of atomic-level interfacial layer and its effect on thermal conductivity of W-coated diamond particles reinforced Al matrix composites

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Cited by 39 publications
(12 citation statements)
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“…Aluminum, being lighter, has a high specific thermal conductivity, which makes it the leading matrix material for heat sink composites in automotive and aerospace electronics, and also in portable electronic devices [ 101 , 102 , 103 , 104 , 105 , 106 ]. However, the high coefficient of thermal expansion (~23 × 10 −6 K −1 ) of aluminum is compensated by reinforcement with carbides (SiC [ 33 , 101 , 107 , 108 , 109 , 110 , 111 , 112 ], B 4 C [ 105 ]), nitride (BN [ 107 , 113 ], Si 3 N 4 [ 114 ], AlN [ 111 , 115 ]), oxides (Al 2 O 3 [ 107 ]), diamond [ 102 , 106 , 116 , 117 , 118 , 119 , 120 , 121 , 122 , 123 , 124 , 125 , 126 ], graphite flakes [ 68 , 127 , 128 , 129 ], and carbon fibers [ 39 , 130 , 131 , 132 , 133 ].…”
Section: Metal Matrix Compositesmentioning
confidence: 99%
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“…Aluminum, being lighter, has a high specific thermal conductivity, which makes it the leading matrix material for heat sink composites in automotive and aerospace electronics, and also in portable electronic devices [ 101 , 102 , 103 , 104 , 105 , 106 ]. However, the high coefficient of thermal expansion (~23 × 10 −6 K −1 ) of aluminum is compensated by reinforcement with carbides (SiC [ 33 , 101 , 107 , 108 , 109 , 110 , 111 , 112 ], B 4 C [ 105 ]), nitride (BN [ 107 , 113 ], Si 3 N 4 [ 114 ], AlN [ 111 , 115 ]), oxides (Al 2 O 3 [ 107 ]), diamond [ 102 , 106 , 116 , 117 , 118 , 119 , 120 , 121 , 122 , 123 , 124 , 125 , 126 ], graphite flakes [ 68 , 127 , 128 , 129 ], and carbon fibers [ 39 , 130 , 131 , 132 , 133 ].…”
Section: Metal Matrix Compositesmentioning
confidence: 99%
“…The formation of a brittle, hydrophilic interfacial phase Al 4 C 3 instead of SiC was considered to serve as a thermal barrier. To prevent the formation of Al 4 C 3 and to improve interfacial bonding, the diamond particles were coated with SiC [ 121 ], TiC [ 116 ], Ti [ 123 ], and W [ 124 ]. A thermal conductivity of 365 Wm −1 K −1 in combination with a low coefficient of thermal expansion of 5.69 × 10 −6 K −1 was reported with 60 vol% TiC-coated diamond particle reinforcement [ 116 ].…”
Section: Metal Matrix Compositesmentioning
confidence: 99%
“…Nevertheless, some traditional thermal management materials, such as Cu/Mo and Cu/W, could no longer fulfill the requirements for high-power electronic devices [ 4 , 5 ]. Thus, metal matrix composites (MMCs) reinforced with high TC carbon materials, such as carbon fibers [ 6 ], graphite, diamond [ 7 ], carbon nanotubes [ 8 ] and graphene [ 9 ], have gradually come into view.…”
Section: Introductionmentioning
confidence: 99%
“…To date, thermal management materials have been developed for several periods, but some traditional thermal management materials, such as Invar, Kovar, SiC/Al, and Si/Al, can no longer fulfill the requirements for high power electronic devices due to insufficient TC [ 3 , 4 ]. In recent years, metal matrix composites (MMCs) reinforced by carbon materials, including carbon fibers [ 5 , 6 ], graphite, diamond [ 7 , 8 ], carbon nanotubes (CNTs) [ 9 , 10 ], and graphene [ 11 ], have become promising materials for thermal management applications due to their high TC and low density.…”
Section: Introductionmentioning
confidence: 99%