The future of lasers in electronics

Thin wafer dicing using a high repetition rate femtosecond laser

“…Wafer thickness, width of the saw streets, composition of the wafer and die size, all have to be considered when formulating the saw parameters. Failure to perform the process correctly can cause mechanical damage to the die [8,9]. Wafers are first mounted on a wafer cutting ring and aligned.…”

Femtosecond Laser Machining At Submicron And Nano Scale

“…), limiting the achievable precision and quality. These shortcomings have spurred the development of ultrafast (pi co-and femtosecond) lasers, which deliver enhanced precision and cleanliness of machined features by minimizing collateral damage, plasma effects and thermal diffusion [11][12][13][14]. Femtosecond (fs) pulsed lasers are emerging as tools for microfabrication of all types of materials that are used in biomedical, microelectronics, photonics and MEMS industries.…”

355nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates

“…As a consequence, miniaturization, function integration, and high density interconnection are manufacturing demands in the electronics industry. These demands necessitate thinner rigid and flexible printed circuit board (PCB) substrates to be used in the electronic devices [1,2]. Therefore, the cutting of thin rigid and flexible PCB substrates is critical in the manufacturing of electronic products.…”