1989
DOI: 10.1109/33.35480
|View full text |Cite
|
Sign up to set email alerts
|

The high-frequency characteristics of tape automated bonding (TAB) interconnects

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
15
0

Year Published

1993
1993
2011
2011

Publication Types

Select...
5
2
1

Relationship

0
8

Authors

Journals

citations
Cited by 22 publications
(15 citation statements)
references
References 11 publications
0
15
0
Order By: Relevance
“…In our lab, Wentworth et al used the model to characterize tape automated bonding (TAB) interconnect in 1989 [3]. In 1996 Gevorgian et al [4] proposed a different model for an IDC with a multilayered top structure based on the same conformal mapping technique.…”
Section: A Confomral Mapping For Idcsmentioning
confidence: 98%
“…In our lab, Wentworth et al used the model to characterize tape automated bonding (TAB) interconnect in 1989 [3]. In 1996 Gevorgian et al [4] proposed a different model for an IDC with a multilayered top structure based on the same conformal mapping technique.…”
Section: A Confomral Mapping For Idcsmentioning
confidence: 98%
“…A finite-element (FEM) program [7] found the capacitances of the waveguides using biquadratic elements that geometrically grew in size away from the conductor corners at a rate of 1.2 times the next closest element. The minimum element dimension was 0.1 m, and the capacitances found for the CPW lines agree to with in 4% of the conformal map predictions [8]. Volume filament method (VFM) [9] and surface ribbon method (SRM) [10] programs determined the frequency-dependent resistances and inductances and , respectively.…”
Section: Numerical Calculationsmentioning
confidence: 98%
“…The design of the line is based on the equations of the coplanar waveguides [7] taking into account the calculation of the characteristic impedance, the constraint rules of the design, and the geometry of RF measurement tips. The geometrical parameters of the transmission line are a length of 1400 lm, an interconnect line width of 71 lm, a pitch of 143 lm between two conductive lines.…”
Section: Electromagnetic Simulation Of Passive Componentsmentioning
confidence: 99%
“…This type of MMF normally has a bandwidth as low as 160 MHz.km at a wavelength of 0.85 lm [7]. There has been much work carried out on extending the usable bandwidth of MMF [7,8].…”
Section: Introductionmentioning
confidence: 99%