2004
DOI: 10.1109/jqe.2004.837329
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The impact of CMP and underlying back-end topographical features on losses in deposited dielectric waveguides

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Cited by 3 publications
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“…in [33], and in some patents (e.g., US5883914, US5239193 and US5978401). In, for example, [34,35], the design and fabrication of 'heterogeneous' structures, where optoelectronic devices are monolithically integrated with microelectronics, are also demonstrated. However, they require not only advanced VLSI technology and large efforts in terms of resources, but also optical characteristics inevitably need to undergo compromises.…”
Section: A Microfabricated Optical Module For Communication and Sensi...mentioning
confidence: 99%
“…in [33], and in some patents (e.g., US5883914, US5239193 and US5978401). In, for example, [34,35], the design and fabrication of 'heterogeneous' structures, where optoelectronic devices are monolithically integrated with microelectronics, are also demonstrated. However, they require not only advanced VLSI technology and large efforts in terms of resources, but also optical characteristics inevitably need to undergo compromises.…”
Section: A Microfabricated Optical Module For Communication and Sensi...mentioning
confidence: 99%