The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits

Wang, Ziren; Gao, Jinchun; Flowers, George T.; Yi, Wei; Wu, Yongle; Cheng, Z.-Y.

doi:10.1109/tcpmt.2020.3019803

Cited by 11 publications

(7 citation statements)

References 20 publications

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“…In consideration of the higher standards for some circuits in engineering applications, the maximum normal equivalent connection inductance used in the simulation model is 1 nH, which is smaller than the 1.6 nH obtained from experimental testing. In addition, the maximum fault connection inductance of bonding wire in the simulation model is 3 nH, which is equal to that obtained from experiment, as shown in Figure 5 [14].…”

Section: Bonding Wiressupporting

confidence: 52%

Intelligent Detection Methods of Electrical Connection Faults in RF Circuits

Wang

Flowers

et al. 2021

Applied Sciences

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Printed circuit boards (PCBs) have a large number of electrical connection nodes. Exposure to harsh environments may lead to connection faults in these nodes. In the present work, intelligent detection methods for electrical connection faults were studied. Specifically, the fault characteristics of connectors, bonding wires and solder balls in the frequency domain were analyzed. The reflection and transmission parameters of an example filter circuit with electrical connection faults were calculated using the Simulation Program with Integrated Circuit Emphasis (SPICE). With these obtained electrical parameters, three machine learning algorithms were used to detect example electrical connection faults for the example circuit. Based upon the performance evaluations of the three algorithms, one can conclude that machine-learning-based intelligent fault detection is a promising technique in diagnosing circuit faults due to electrical connection issues with high accuracy and lower time cost as compared to current manual processes.

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Section: Bonding Wiressupporting

confidence: 52%

Intelligent Detection Methods of Electrical Connection Faults in RF Circuits

Wang

Flowers

et al. 2021

Applied Sciences

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“…For research on the electrical performance of radio frequency (RF) circuits with bonding wire, Ndip et al, 1,2 developed a model for the equivalent inductance of bonding wires based on their shapes, bonding parameters, and materials. Wang et al 3 studied the influence of bonding wire failure on DC and AC characteristics of circuits. They showed the effects of different positions and numbers of bonding wires failure on high frequency signal transmission.…”

Section: Introductionmentioning

confidence: 99%

Investigation of impedance compensation in radio frequency circuits with bonding wire

Wang

Gao

Flowers

et al. 2022

Int J RF Mic Comp-Aid Eng

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Bonding wires are extensively used to provide electrical interconnections in communication systems. From the perspective of circuit analysis, the effects of such elements are often treated as an inductance. Bonding wires may cause inductive impedance discontinuity, which negatively impacts signal integrity. In this work, an impedance compensation technique using a chip capacitor was introduced. The electrical performance was improved significantly in the frequency band below 4 GHz. In order to expand the operating frequency of the circuit, another compensation approach based on adding a ground conductor was also studied. This compensation strategy is shown to be effective for frequencies up to 18 GHz. The results obtained from the model simulation for both strategies were also validated experimentally. The model simulation results for both approaches show good agreement with those obtained from the experimental measurements.

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“…Many researches have been conducted on the transmission characteristics of bondwires. [1][2][3][4][5][6][7][8] In Reference 1, a finite-difference time-domain (FDTD) method is proposed for the rigorous analysis of bondwire's modeling and electrical characterization. In addition, a quasistatic model was proposed and proved its practicality.…”

Section: Introductionmentioning

confidence: 99%

“…In Reference 7, the influence of the platform length, diameter, span, bonding height parameters and the loops of bondwire is discussed in relation to the S parameters. 8 analyzed the influence of bondwire failure on high-frequency characteristics, and proposed a 3D electromagnetic field numerical calculation model and distributed parameter circuit model.…”

Section: Introductionmentioning

confidence: 99%

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Zhong

Song

et al. 2022

Int J RF Mic Comp-Aid Eng

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Wire bonding is widely used in various radio frequency (RF) devices and is one of the common forms of signal interconnection. In this article, a new geometric model with related physical parameters is used to describe various actual types of the bondwire, and the corresponding calculation method for the total length of the bondwire is obtained. Consequently, a new equivalent circuit modeling method of the single‐bondwire can be developed and the accuracy of model has been improved. On this basis, using the concept of partial inductance, the modeling method of double‐bondwire is proposed, which can be applied to asymmetric double‐bondwire modeling. The model of bondwire obtained by this modeling method is applied to the design of PA, and the special electrical properties of the bondwire are used to verify a novel harmonic control method, which second and third harmonics could be controlled. The results show that in the Sub‐6G, the proposed bondwire model has good accuracy, and its performance is close to the measured results. The designed PA combined with harmonic control network has good performance, achieving drain efficiency of 62.6%–70% and output power of 40–41.5 dBm at 3.2–3.8 GHz. It is proved that the proposed bonding line modeling method can be applied to the design of high‐efficient PA.

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The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits

Cited by 11 publications

References 20 publications

Intelligent Detection Methods of Electrical Connection Faults in RF Circuits

Intelligent Detection Methods of Electrical Connection Faults in RF Circuits

Investigation of impedance compensation in radio frequency circuits with bonding wire

Study of harmonic control power amplifier technology based on improved modeling of bondwire

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