The impact of temperature on wave interaction with damage in composite structures

Apalowo, R.K.; Chronopoulos, Dimitrios; Ichchou, Mohamed; Essa, Yasser; Escalera, Federico Martín de la

doi:10.1177/0954406217718217

Cited by 6 publications

(5 citation statements)

References 51 publications

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“…Solder joints are applied to provide structural support and transmit signal in electronic packages such as ball grid array (BGA), flip chip package, wafer level package, dual inline packaging and chip size package (Longford, 2005). An accelerated thermomechanical cycling test is suitable for characterizing package lifetime (Apalowo et al , 2017). Subjecting these packages to thermomechanical cycling will result in the joints' periodic fatigue and stress due to the coefficient of thermal expansion (CTE) mismatch among the different components comprising the packages and the printed circuit board (Kim and Lee, 2007).…”

Section: Introductionmentioning

confidence: 99%

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Apalowo,

Abas,

Muhamed Mukhtar

et al. 2024

SSMT

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Purpose This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue. Design/methodology/approach The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated. Findings Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length. Practical implications This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints. Originality/value The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

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Section: Introductionmentioning

confidence: 99%

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Apalowo,

Abas,

Muhamed Mukhtar

et al. 2024

SSMT

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“…Fracture mechanics provides a tool for evaluating the criticality of defects in structural systems (Apalowo et al , 2017). Various researchers have applied numerical and experimental fracture mechanics techniques to examine the defect growth behavior of soldered electronic packages in a thermal environment.…”

Section: Introductionmentioning

confidence: 99%

Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation

Apalowo,

Abas,

Bachok

et al. 2024

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Purpose This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process. Design/methodology/approach Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS. Findings Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm. Practical implications This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs. Originality/value Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

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“…The approach has recently found applications in predicting the vibroacoustic and dynamic performance of composite panels [30,31]. The variability of vibroacoustic transmission through layered structures [32] as well as structural identification [33] have been investigated through the same methodology.…”

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confidence: 99%

A wave-based numerical scheme for damage detection and identification in two-dimensional composite structures

Apalowo

Chronopoulos

2019

Composite Structures

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Previous studies on wave inspection in different propagation directions have focussed on the analysis of wave propagation and wave scattering from various types of joints in two-dimensional monolayered structures. In this work, a Finite Element (FE) based numerical scheme is presented for quantifying wave interaction with localised structural damage within two-dimensional layered composite structures having arbitrary layering, complexities and material characteristics. The scheme discretise a damaged structural medium into a system of N healthy substructures (waveguides) connected through a joint which bears the localised structural damage/discontinuity. Wave propagation constants along different propagation directions of the substructures are sought by combining Periodic Structure Theory (PST) and the FE method. The damaged joint is modelled using standard FE approach, ensuring joint-substructures mesh conformity. This is coupled to the obtained wave propagation constants in order to determine scattering coefficients for the wave interaction with damage in different propagation directions within the structure. Wave interaction coefficients for different damage types and structural parameters are analysed in order to establish an optimum basis for detecting and identifying damage, as well as assessing the orientation and extent of the detected damage. The main advantage of this scheme is precise predictions at a very low computational cost.

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The impact of temperature on wave interaction with damage in composite structures

Abstract: The increased use of composite materials in modern aerospace and automotive structures, and the broad range of launch vehicles' operating temperature imply a great temperature range for which the structures has to be frequently and thoroughly inspected.

Cited by 6 publications

References 51 publications

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation

A wave-based numerical scheme for damage detection and identification in two-dimensional composite structures

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