The influence of citrate and tartrate on the electrodeposition and surface morphology of Cu–Ni layers

Abstract

This study examined the influence of citrate and tartrate as complexing agents on the electrodeposition and surface morphology of Cu-Ni layers. The alloys obtained in the tartaric acid and sulphate baths were nobler than those obtained in the citric acid/citrate and citric acid/ citrate/tartaric acid media. The results indicated that the complexing medium influences the nobility and the type of mass transport of the alloy formed. The morphology of the electrodeposited Cu-Ni layers changed from a rather porous appearance in the absence of the complexing agents to nodular, cracked mud and cauliflower appearances for the citric acid/sodium citrate/sodium sulphate medium, tartaric acid/sodium sulphate medium and citric acid/sodium citrate/tartaric acid/sodium sulphate medium, respectively. The chemical composition of the Cu-Ni layers revealed the preferential deposition of copper. The ultraviolet-visible spectrophotometry measurements indicated the occurrence of the d-d type transition, regardless of the complexing medium employed.

Electrodeposition of Co-rich Cu-Co Alloys from Sodium Tartrate Baths Using Direct (DC) and Single Pulsed Current (SPC)

“…Tartrate is the anion of a dicarboxylic acid and can originate stable complexes with both Cu (II) and other M (II) ions [21][22][23][24] . In fact, ammonium tartrate has been used to produce stable alkaline baths for the Fe-Co-Pt alloy deposition 25 , while a mixed bath composed of sodium tartrate and sodium citrate has enhanced the quality of the Cu-Ni alloy coatings produced by electrodeposition in platinum substrate 26 . Tartrate has also been studied as a levelling additive for the electrodeposition of Cu-Sn alloy 27 , influencing the layer morphology and decreasing the energy consumption during the electrodeposition process.…”

“…Cu-Co alloy coatings can be deposited by using direct current (DC) or pulsed current (PC). Each process affects the mass transport, current distribution and the electrical double layer differently, producing coatings with diverse composition, surface roughness and morphology [24][25][26][27][28][29][30][31][32][33][34] . Although the less cost and more simplicity of the DC, several studies show that the use of pulsed current presents some advantages in the alloy electrodeposition, enhancing the adhesion, density, resistivity and ductility of the coatings.…”

EFFECT OF CHLORIDE IONS ON THE STRUCTURAL, OPTICAL, MORPHOLOGICAL, AND ELECTROCHEMICAL PROPERTIES OF Cu2O FILMS ELECTRODEPOSITED ON FLUORINE-DOPED TIN OXIDE SUBSTRATE FROM A DMSO SOLUTION

“…These films were p-type semiconductors with an optical band gap that varied between 2.18 eV -2.25 eV with a doping level between 8.2 x 10 18 cm -3 -2.0 x 10 19 cm -3 , depending on the electrodeposition temperature. On the other hand, it is a well known fact that during the electrodeposition process, the addition of complexing agents produces drastic changes in the morphology and properties of semiconductor materials 12-13 and metals [14][15] . This way, the influence of chloride ions as a complexing agent during the Cu 2 O electrodeposition process from a DMSO solution is analyzed in this article.…”

Estudo Do Comportamento Da Resistência À Corrosão Da Liga Co-W Obtida Pelo Processo De Eletrodeposição Usando Tartarato De Sódio Como Agente Complexante

“…Na eletrodeposição da liga Co-W foi utilizado como agente complexante o tartarato de sódio, que é um quelante com dois grupos doadores. O complexante presente no banho eletrolítico comporta-se como uma base de Lewis enquanto que os íons dos metais (Co 2+ , W 6+ ) compartam-se como ácido de Lewis [8]. O planejamento fatorial experimental apresenta muitas vantagens sobre os métodos univariantes.…”