2020
DOI: 10.3390/s20071920
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The Influence of Laser Modification on a Composite Substrate and the Resistance of Thin Layers Created Using the PVD Process

Abstract: For physical vapor deposition (PVD) technology, cleaning a substrate is one of the key preliminary processes before depositing the metal layer. In this article, we present the results of research on the modification of a textile composite substrate using laser technology and its influence on the surface resistance of silver structures intended for use in wearable electronics. As a result of the substrate modification, the resistance of the layers increased as compared with the structures produced on an unmodif… Show more

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Cited by 5 publications
(4 citation statements)
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“…The different techniques used to make conductive fibres are sputtering, chemical polymerization, electrodeposition, and dip coating. The first two mentioned techniques, i.e., sputtering and chemical polymerization, are both classified as Physical Vapor Deposition (PVD) processes [ 23 , 24 ]. PVD is a coating process carried out in a vacuum in which thin films are deposited by the condensation of a vaporized form of the desired film material onto the substrate.…”
Section: Textile Technologiesmentioning
confidence: 99%
“…The different techniques used to make conductive fibres are sputtering, chemical polymerization, electrodeposition, and dip coating. The first two mentioned techniques, i.e., sputtering and chemical polymerization, are both classified as Physical Vapor Deposition (PVD) processes [ 23 , 24 ]. PVD is a coating process carried out in a vacuum in which thin films are deposited by the condensation of a vaporized form of the desired film material onto the substrate.…”
Section: Textile Technologiesmentioning
confidence: 99%
“…The criteria for assessing the obtained elements were the following: the accuracy of mapping the dimensions of the bar, the continuity of the structure (the bar cannot be broken), and the smoothness of the cut edges. The optimization of the parameters of the laser cutting process was performed using the experiment planning method [23,24]. The following parameters were set as the input parameters: laser beam power (2-10 W), pulse repetition frequency (35-270 kHz), beam speed (200-2000 mm/s), and pulse duration (15-220 ns).…”
Section: Optimalization Of the Mask-cutting Processmentioning
confidence: 99%
“…For these parameters, in order to cut holes in the foil of thickness of 35 µ m and 30 µ m, the scanning should be repeated 50 times. For a foil of thickness of 120 The optimization of the parameters of the laser cutting process was performed using the experiment planning method [23,24]. The following parameters were set as the input parameters: laser beam power (2-10 W), pulse repetition frequency (35-270 kHz), beam speed (200-2000 mm/s), and pulse duration (15-220 ns).…”
Section: Optimalization Of the Mask-cutting Processmentioning
confidence: 99%
“…Traditional LM circuit preparation has been challenging to develop further. Laser technology has been widely used in various fields, for example: textile electronic [ 39 ], composite materials [ 40 ], biomedical science [ 41 , 42 , 43 ], and so on. To the best of our knowledge, there have been few reports on the fabrication of ultra-micro LM electronic devices by laser engraving [ 44 , 45 ].…”
Section: Introductionmentioning
confidence: 99%