The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates

Duan, Nian; Scheer, J; Bielen, J.A.; Kleef, M. van

doi:10.1016/s0026-2714(03)00135-5

Cited by 32 publications

(13 citation statements)

References 8 publications

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“…The shear speed in their study is 0.2 mm/s. Duan et al [22] reported that the shear strength tested at the displacement rate of 0.05 mm/s slightly decrease with increasing on the Sn-37Pb and Sn-3.5Ag-0.75Cu BGAs placed on the Ni (P)/Au surface-finished substrates aged at 100, 125 and 150 • C. The shear test speeds (0.2 and 0.05 mm/s) used in these studies are much lower than that of the present study. In the present study, under low shear speed conditions (10 mm/s), the aging treatment can also decrease the shear strength.…”

Section: Discussionmentioning

confidence: 99%

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Tsukamoto

Nishimura

Suenaga

et al. 2010

Materials Science and Engineering: B

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Section: Discussionmentioning

confidence: 99%

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Tsukamoto

Nishimura

Suenaga

et al. 2010

Materials Science and Engineering: B

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“…When conventional long time reflow soldering methods and a solder of large volume are used to fabricate a solder joint, the Au layer will dissolve into the solder completely, and then a small amount of dispersed AuSn 4 IMCs will form, which will not cause embrittlement of the solder joint [5]. However, when the content of Au in the solder joint is greater than a critcal value, the reliability of the solder joint will deteriorate [6,7].…”

Section: Introductionmentioning

confidence: 99%

Effect of protection atmosphere's temperature on morphology of Au-Sn IMCs in laser reflowed micro-solder joints

Liu

Wang²,

Sun

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Formation of AuSn x IMCs in laser reflowed solder joints protected by N 2 atmosphere at room temperature, 60℃, 100℃ and 130℃ was investigated respectively. The solder balls were Sn-2.0Ag-0.75Cu-3.0Bi, and 120μm in diameter. The surface finish of one pad in the solder joints was 4.0μmAu/0.1μmNiFe/0.01μmTa, the other pad was made of Cu plated with 3.0μm thickness of Au. The laser reflow time was within 10ms. AuSn 4 IMCs and Au-riched phases formed at the interfaces of solder and pads, the AuSn 4 was needle-like in morphology in the solder joints protected by N 2 atmosphere at room temperature. As the temperature of N 2 atmosphere was increased to higher than 100 ℃, almost all of the Auriched phases disappeared, more needle-like AuSn 4 IMCs formed at the interface, and orientation of the IMCs changed obviously as compared with that in the solder joints protected by N 2 atmosphere at room temperature. The results indicated that the temperature of protection atmosphere would affect the Au-Sn interfacial reaction in the solder joints fabricated by laser reflow process evidently, even the reflow time was shorter than 10ms. Therefore, by regulating the temperature of protection atmosphere, we may control the morphology of Au-Sn IMCs in the laser reflowed micro-solder joints, and achieve solder joints with good properties.

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“…When conventional long time reflow soldering methods or large volume solder is used to fabricated a solder joint, the Au layer will be dissolved into the solder completely, the formation of small amount of dispersed AuSn4 will not cause the embitterment of the solder joint. Whereas, when the content of Au in the solder joint is greater than the critical limit, brittle and weak solder joint will be formed [5][6][7]. Whereas, the size of solder joints is getting smaller and smaller, the content of Au in the solder joints will increase greatly.…”

Section: Introductionmentioning

confidence: 99%

Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints during Isothermal Aging Process

Liu

Wang

Tian

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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Au surface finish is common used as a protection layer on pads. In the traditional reflow process, Au will be dissolved into solder and form AuSn4 IMCs (intermetallic components). However, as for the solder joints fabricated by laser soldering, the morphology and distribution of the AuSn, IMCs are quite different from that in solder joints fabricated by traditional reflow methods. The formation, distribution and evolution of IMCs will affect the property and reliability of solder joints directly. This paper presents a detailed analysis of AuSn, IMCs evolution in laser reflowed solder joints during isothermal aging process. To investigate the effect of Au thickness on the evolution of AuSn, IMCs, pads with 0.1, 0.5, 0.9 or 4.0 gmAu surface finish were introduced into our experiment. The solder joints were aged in the 125°C isothermal oven. Experiment results showed that few IMCs formed at the interface of the solder and the pad with 0.1gm Au surface finish. Even in the condition of 31 days aging, the thickness of IMCs didn't increase a lot; as for the laser reflowed solder joints with 0.5 or 0.9gm Au surface finish on the pad, most of the AuSn4 IMCs stayed at the interface and formed in needle-like or dendritic morphology. With the increase of aging time, the AuSn4 IMCs became more flat and changed to a continuous layer; In the laser reflowed solder joints with 4.0gm Au surface finish on the pad, AuSn, AuSn2, AuSn4 IMCs and Au2Sn phase formed at the interface. With the increase of aging time, more Sn rich IMCs formed at the interface, and evolved to AuSn4 IMCs in the condition of long time aging. The thickness of AuSn4 IMCs can reach about 30gm.

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The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates

Cited by 32 publications

References 8 publications

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Effect of protection atmosphere's temperature on morphology of Au-Sn IMCs in laser reflowed micro-solder joints

Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints during Isothermal Aging Process

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