The influence of thermal diffusion on laser ablation of metal films

Matthias, E.; Reichling, Michael; Siegel, J.; Käding, O. W.; Petzoldt, S.; Skurk, H.; Bizenberger, Peter; Neske, E.

doi:10.1007/bf00332169

Cited by 196 publications

(84 citation statements)

References 17 publications

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“…2. This behavior is different from that observed for metal films of a similar thickness where the threshold fluence for ablation is thickness-dependent [21]. Because of the higher thermal conductivity heat equilibrates more rapidly in a metal film and is effectively confined there if the supporting substrate has a lower thermal conductivity as is the case for fused silica.…”

Section: Resultscontrasting

confidence: 58%

Ablation of silicon suboxide thin layers

Jahn

Richter

Weichenhain-Schriever

et al. 2010

Appl. Phys. A

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We investigate the ablation of SiO x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm 2 to above 3 J/cm 2 . SiO x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm 2 ) the ablation depth corresponds roughly to the film thickness, above 1 J/cm 2 part of the substrate is ablated as well. In the case of frontside ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm 2 . Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.

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Section: Resultscontrasting

confidence: 58%

Ablation of silicon suboxide thin layers

Jahn

Richter

Weichenhain-Schriever

et al. 2010

Appl. Phys. A

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“…The distance a change of temperature would propagate during a pulse duration can be de ned by the thermal di usion length, which is expressed as [25]: 2L = 2 p t 0 ; (2) where is the thermal di usivity of the material and is equal to k=c. As the pulse width of the laser is less than 10 ps, the thermal di usivity length values for a CBN grain, vitri ed bond, and resin bond material would be 0.17 m, 0.02 m, and 0.0025 m, respectively, which are much smaller than the average grain size and the beam diameter in both cases.…”

Section: Thermal Analysis Of Laser Conditioningmentioning

confidence: 99%

Conditioning of vitrified and resin bond CBN grinding wheels using a picosecond laser

2017

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Abstract. Laser ablation is a novel non-mechanical wheel preparation method for optimizing the treatment costs of superabrasive tools. In this study, the thermal e ects of picosecond laser radiation on vitri ed and resin bond CBN superabrasive grinding wheel surfaces were analytically and experimentally investigated. The analytical approach was intended to nd threshold process parameters for selective ablation of cutting grains and bond material. A picosecond Yb:YAG laser device was integrated with a cylindrical grinding machine, which facilitated the treatment of grinding wheel as it was mounted on the grinding spindle. It is shown that the extent of material ablation is de ned by the maximum surface temperature induced by the laser radiation, which is in turn de ned by the laser pulse energy. It is also suggested that the depth of laser thermal e ects is governed by the relative speed of the laser scanner with respect to the wheel surface.

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“…Previous experiments on laser ablation of metallic thin films have demonstrated that the ablation threshold increases linearly with the film thickness up to the thermal diffusion length, after which it remains constant [13].…”

Section: Chemical Composition and Thin Film Thicknessmentioning

confidence: 99%

Laser ablation of a Cu–Al–Ni combinatorial thin film library: analysis of crater morphology and geometry

et al. 2016

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The conventional approach to studying laserworkpiece interaction in the ablation regime is to vary beam parameters used on a specimen of uniform chemical composition. The current work instead utilises a pulsed laser beam of constant parameters to ablate a ternary alloy thin film where the chemical composition of the sample varies continuously; this will enhance the understanding of pulsed laser ablation by means of a combinatorial approach. The analysis of the studied workpiece (a Cu-AlNi thin film deposited by magnetron sputtering) revealed the presence of both compositional and morphological gradients. Variation in the surface morphology was correlated with aluminium content. Single-pulse laser ablation (Nd:YAG, 1064 nm, 30 ns, 4.54 J/cm 2 ) of the surface resulted in different crater features, geometry and volume. Two characteristic regions separated by a transition zone were identified based on the craters' geometrical and morphological characteristics. The ablated volume increases with the atomic percentage of aluminium up to a threshold value of roughly 30 at.% after which the ablation volume slowly declines. This phenomenon may be attributed to plasma absorption and heat dissipation in the thin film.

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The influence of thermal diffusion on laser ablation of metal films

Cited by 196 publications

References 17 publications

Ablation of silicon suboxide thin layers

Ablation of silicon suboxide thin layers

Conditioning of vitrified and resin bond CBN grinding wheels using a picosecond laser

Laser ablation of a Cu–Al–Ni combinatorial thin film library: analysis of crater morphology and geometry

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