The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure

Abstract

Electronically conductive adhesives (ECAs) have received a great deal of attention in recent years for interconnection applications. Even though ECAs have excellent potential for being efficient and less costly alternative to solder joining in electronic components, they still suffer from a number of problems relative to durability and design to meet specific needs. These include issues with the formulations of the conductive adhesive and its interactions with the substrate surface. In order to study these problems, we prepared two different adherends varying in surface characteristics and bonded them with three different conductive adhesive formulations with varying particle loadings, shapes and sizes of conductive nickel fillers. Joints were also prepared with two different adhesive thicknesses, and the effects were discussed in Part I of this paper. This part discusses the effects of filler surface properties, volume fraction and bonding under different levels of pressure to gain insight into the influence of these parameters on the joint strength, deformation and joint conductivity. Our results showed that chemical etching of particles, which changes the shape of the particles, has a profound effect on the joint strength, deformation and electrical conduction behavior. We note that prolonged period of chemical etching of spherical Ni-110 particles with hydrochloric acid causes irregularities in the shape of the nickel particles, and an increase of 60% in the joint resistance. Higher bonding pressure generally resulted in lower failure load and ultimate displacement values, indicating the possibility of squeeze flow for the neat resin under high pressure. Incorporation of larger particles in the adhesive formulation yielded a more efficient resin squeeze mechanism.

Electrically Conductive Epoxy Adhesives

“…The processing parameters, such as temperature, pressure, cure time, pot and shelf life are critical to the success of making reliable electrical and mechanical interconnections. A conductive adhesive joint may fail in many different ways [10][11][12][13][14][15][16][17][18][19][20][21][22][23]. These include thermal stresses caused by the coefficient of thermal expansion mismatch between the substrate and component, and by mismatch between the adhesive and adherend during temperature cycling, oxidation of the bonding surfaces and of the filler, and degradation by UV-light or corrosive gases.…”

Yield Behavior of Moderately Filled Epoxy/Ni Suspensions

“…Theoretical and experimental studies have been performed on basic conduction mechanisms [4][5][6][7][8][9], along with studies including the effects of particle size, shape and type [10][11][12][13][14][15]. The behaviors of these adhesives in the bonded form were also studied [12,[14][15][16][17][18][19][20][21][22].…”

“…Theoretical and experimental studies have been performed on basic conduction mechanisms [4][5][6][7][8][9], along with studies including the effects of particle size, shape and type [10][11][12][13][14][15]. The behaviors of these adhesives in the bonded form were also studied [12,[14][15][16][17][18][19][20][21][22]. Studies on processing effects included works on the effects of pressure [8,10,15], effects of adhesive film thickness [9,11,14], effects of silver coating [10,11,13], and on anisotropic alignment of nickel particles in magnetic field [13], as well as the work on the possibility of using polyaniline emeraldine salt particles as conductive fillers [23].…”

Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure

“…There are many reports in respect to joining pressures in packaging with conductive adhesives [2][3][4][5][6][7][8][9][10], predominantly focused on anisotropic conductive adhesives (ACAs). Joining pressure for packaging with ACAs is important as a process parameter.…”

“…The [11]. There is also a report on the relationship of low joining pressure and joint strength using model specimens [10]. However, there are no reports of investigations into quantitatively controlled low joining pressures and joint strengths.…”