The low-k epoxy/cyanate nanocomposite modified with epoxy-based POSS: The effect of microstructure on dielectric properties

Li, Xiaodan; Liu, Xiaoqing; Liu, Hongyu; He, Rui; Wang, Rui; Meng, Shuangming; Li, Zhaomin

doi:10.1016/j.reactfunctpolym.2023.105522

Cited by 13 publications

(9 citation statements)

References 45 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The absorption of moisture by the resin leads to swelling, wherein various components within the packaging materials exhibit different swelling tendencies, and this divergence generates hygroscopic stress, impacting the material’s longevity. , Moreover, the presence of water molecules, being polar, can influence the dielectric properties of the material Figure c illustrates the variation in the water absorption by the resin.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Liu,

Qin,

Cui

et al. 2024

Ind. Eng. Chem. Res.

View full text Add to dashboard Cite

Cycloaliphatic epoxy resins are known for their synthesis process that eliminates hydrolyzable chlorine, thus avoiding the hydrolysis of hydrolyzable chlorine to hydroxyl groups in conventional epoxies, which is very favorable for the preparation of low dielectric epoxy resins. The curing process using active ester generates no hydroxyl groups, also indicating a promising approach for producing low dielectric epoxy resins. However, the resistance of cycloaliphatic epoxy to nucleophilic reactions restricts it from reacting usually only with anhydrides. This study investigates the reactivity of the active ester with cycloaliphatic epoxy, demonstrating its capability to undergo complete curing reactions at temperatures near 150 °C. Factors influencing this process, including the volatilization of the catalyst DMAP and its reactivity, are examined. Two types of cycloaliphatic epoxies (3,4-epoxycyclohexylmethyl-3′,4'-epoxycyclohexane carboxylate (EEC) and bis (3,4-epoxycyclohexylmethyl) adipate (BEA)) are combined with an active ester hardener, triacetyl resveratrol (TAR), to prepare epoxy resins. The activation energies for the curing reactions are determined, and the optimal concentration of catalyst 4-dimethylaminopyridine (DMAP) is identified for each resin. The use of catalysts at specific concentrations results in resins with superior mechanical properties (91.7 and 71.4 MPa for EEC/TAR and BEA/TAR), excellent thermal stability (T d5% of 354 and 347 °C), and good dielectric properties (dielectric constant of 3.68 and 3.95 at 10 MHz), outperforming anhydride-cured cycloaliphatic epoxy resins. These findings expand the selection of hardeners for cycloaliphatic epoxy resins and highlight the potential of the prepared resins in electronic packaging materials, offering enhanced properties suitable for various applications.

show abstract

Section: Resultsmentioning

confidence: 99%

“…41,42 Moreover, the presence of water molecules, being polar, can influence the dielectric properties of the material. 43 Figure 7c illustrates the variation in the water absorption by the resin.…”

Section: Coefficient Of Thermal Expansion (Cte)mentioning

confidence: 99%

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Liu,

Qin,

Cui

et al. 2024

Ind. Eng. Chem. Res.

View full text Add to dashboard Cite

show abstract

“…Theoretically, the dielectric constant of polymeric materials can be scaled down using the following two main strategies: (i) one is to lower the dipole density by inserting the large free volume groups in molecule design or well-controlled pores ( κ air = 1) into polymeric substrate. 22–25 (ii) the other is to lower the dipole polarization strength by introducing the least polarizable groups such as C–H, C–C, C–Si, C–O and C–F bonds into the polymer chain. Although porous polymer films generally exhibit much lower κ values through effective foaming processes ( e.g.…”

Section: Introductionmentioning

confidence: 99%

Facile strategy for intrinsic low-κ dielectric polymers: molecular design based on space charge conservation

Ren,

Li,

Huang

et al. 2024

Mater. Horiz.

View full text Add to dashboard Cite

show abstract

“…7,8 Therefore, it is promising to integrate the advantages of both thermoset by the reaction between the epoxy groups of EP and the -C≡N groups of CE. 9,10 Nevertheless, the flammability of epoxy resin/cyanate ester copolymer (EC) restricts its applications. 11,12 It is important to endow EC with flame retardancy while maintaining good mechanical and low dielectric performances as well.…”

Section: Introductionmentioning

confidence: 99%

Epoxy resin/cyannate ester copolymer with improved fire safety, mechanical properties and low dielectric loss enabled by 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphazephenanthrene-10-oxide and copper hydroxystannate

Huang,

Wang

2023

High Performance Polymers

View full text Add to dashboard Cite

Epoxy resin/cyanate ester copolymer (EC) possesses the advantages of low dielectric constant and low dielectric loss, while the easy flammability of EC restricts its applications. The effect of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphazephenanthrene-10-oxide (DQ) and copper hydroxystannate (CuHS) on the flame retardancy, smoke suppression, mechanical properties and thermal decomposition behavior of EC was studied. The EC composite containing 7 wt% DQ and 3 wt% CuHS (EC/7DQ3CuHS) passed the UL-94 V0 rating with a limiting oxygen index of 32.0% The peak heat release rate and total heat release of EC/7DQ3CuHS fell by 41.9% and 35.0% respectively, compared with those of pure EC. The total smoke release of EC/7DQ3CuHS was reduced by 36.0% in comparison with that of the EC composite containing 10 wt% DQ. The tensile and impact strengths of the EC composite with 9 wt% DQ and 1 wt% CuHS increased by 16.9% and 19.2%, respectively in contrast with pure EC. The dielectric constant and dielectric loss of the EC composites maintained at relative low values. The as-prepared EC composites have application prospect in electronic packaging industry.

show abstract

The low-k epoxy/cyanate nanocomposite modified with epoxy-based POSS: The effect of microstructure on dielectric properties

Cited by 13 publications

References 45 publications

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Facile strategy for intrinsic low-κ dielectric polymers: molecular design based on space charge conservation

Epoxy resin/cyannate ester copolymer with improved fire safety, mechanical properties and low dielectric loss enabled by 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphazephenanthrene-10-oxide and copper hydroxystannate

Contact Info

Product

Resources

About