The microstructural evolution and formation mechanism in Si3N4/AgCuTi/Kovar braze joints

Xin, Chenglai; Jin, Yan; Wang, Hongtao; Feng, Wei; Xin, Chengyun

doi:10.1016/j.jallcom.2019.153189

Cited by 31 publications

(10 citation statements)

References 20 publications

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“…These chemical reactions led to partial dissociation of ceramic layers in laminates 10 and solution during heating and super saturation—precipitation during cooling processes 11 . High temperature–pressure bonding ensures completion of reaction at interface but causes destructive occurrence of diffuse out of elements, 12 isolated voids, 6 interface movement, 13 kirkendall porosities, 14 deleterious reaction products, and severe volume change during reaction and local stressfiges 15 . A new approach of improving bond quality 16 and even decreasing bonding pressure and temperature 17 can be based on simultaneous reduction of interlayer materials/adjacent ceramic interface 18 and formation of homogeneous bonding products 19 with minimum mismatch with ceramic laminates.…”

Section: Introductionmentioning

confidence: 99%

The diffuse interface phase‐field model for in situ interlayer phase formations in low‐temperature reaction bonding of alumina laminates—A theoretical and experimental comparison

Hosseinabadi

2022

J Am Ceram Soc.

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A diffuse interface phase‐field model is developed to study alumina seamless laminate composites formation via reaction interlayer diffusion bonding. The model was designed to indicate the important role of interface on phase transition and interfacial chemical reactions. The model has indicated the interfacial reactions, phase transitions, and phase evolution along the alumina/reaction layer interface. The theoretical results were assessed, validated, and confirmed by experimental data at similar bonding conditions via targeted diffusion bonding in aluminum‐alkaline earth hydride and alanate interlayer systems Me (Me: Mg–Sr). The alanates and hydrides dissociations left pockets of intermetallic phases at interlayer as bonding constituents. The solid‐state bonds have formed by diffusion bonding at laminate interfaces and partial oxidations. The elemental analysis showed the alkaline earth rich zones at interlayer and near interfaces. The crystalline composition of the interlayer materials was combinations of polycrystalline mixed oxide layers, formed due to different oxidation kinetics and diffusion rates. Interlayer oxidation products were combination of complex oxides with SruMgxAlyOz (u: 0.8–1, x: 0.7–1, y: 2–10, z: 4–17) stoichiometry.

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Section: Introductionmentioning

confidence: 99%

The diffuse interface phase‐field model for in situ interlayer phase formations in low‐temperature reaction bonding of alumina laminates—A theoretical and experimental comparison

Hosseinabadi

2022

J Am Ceram Soc.

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“…Therefore, it is necessary to understand the diffusion behavior of atoms during the brazing. Diffusion activation energy ( Q ) and the diffusion coefficient ( D ) are physical quantities that describe how easily atoms can diffuse [ 31 , 32 , 33 ]. Theoretical analysis and experiments show that there is a semi-empirical correlation between the Q and the pre-exponential factor in the Arrhenius equation of the diffusion equation [ 34 , 35 , 36 , 37 ].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Mechanical Properties of 1Cr18Ni9Ti/1Cr21Ni5Ti Stainless Steel Joints Brazed with Mn-Based Brazing Filler

Chen

Chen²,

Yang³

et al. 2022

Materials

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The problem of stainless steel brazing is still the focus of scientific research. In this work, the Mn-based brazing filler was used to braze 1Cr18Ni9Ti and 1Cr21Ni5Ti stainless steel. The typical microstructure of the 1Cr18Ni9Ti/1Cr21Ni5Ti joint was analyzed in detail, and the interface structure of the joint was determined to be 1Cr18Ni9Ti/Mn(s, s)/1Cr21Ni5Ti. The brazing temperature and holding time were shown to have a great influence on the microstructure of the brazed joint. The tensile strength of brazed joints first increased and then decreased with the rising of the brazing temperature and the holding time. The maximum tensile strength was 566 MPa when the joints were brazed at 1125 °C for 15 min. The diffusion of Mn and Cr was an important factor affecting the quality of the joints. The diffusion distances of Mn and Cr at different brazing temperatures and holding times were measured, and the diffusion activation energy and diffusion coefficient were achieved by the Arrhenius equation.

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“…Summarizing the previous research, it states clearly that adding active Ti can make the best improvement of wettability and mechanical properties of active solder. However, most research on active solder added Ti was mainly focused on the field of high temperature active welding [8][9][10], and the research on welding at low temperature is less. Especially for SnAgTi, only Chang and Tsao etc.…”

Section: Introductionmentioning

confidence: 99%

Adsorption and interface reaction in direct active bonding of GaAs to GaAs using Sn–Ag–Ti solder filler

Cheng

Yue

Jiang

et al. 2021

J Mater Sci: Mater Electron

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The element diffusion behavior, the interfacial evolution and mechanical properties of the joining of gallium arsenide (GaAs) with Sn3.5Ag4Ti(Ce,Ga) alloy filler at 250 °C in air were investigated. The interfacial microstructure, elemental diffusion and absorption, interface reaction and evolution were analyzed in detail. Titanium (Ti) and gallium (Ga) element were found to obviously take part in the active bonding between GaAs substrate and Sn3.5Ag4Ti(Ce,Ga) alloy filler. According to the transmission electron microscopy analysis, the titanium elements were observed to successively segregate at the interface, while some of the element Ga included in GaAs to dissolve into the molten alloy. In addition, there is a resultant formed discontiniously along the interface which was identified as Ga 4 Ti 5 , but no arsenic compounds were observed. The joining mechanisms related to the adsorption and reaction were discussed based on the thermodynamics theories, the molecular dynamic (MD) model and the reaction product controlled (RPC) model. The analysis results show that the RPC model was a special form of MD model, both the chemical reaction and the adsorption of active elements may control the reactive wetting of Sn3.5Ag4-Ti(Ce,Ga) filler alloy on GaAs substrate together. In order to better understand the interfacial evolution of bonding, a simple interfacial evolution model between GaAs substrate and Sn3.5Ag4Ti(Ce, Ga) active solder was established. Finally, the effect of holding time on shear strength was investigated and the maximum shear strength of 23.32 MPa was obtained when soldered at 250 °C for 1 h. The interface separation could be caused by the mixed fracture mechanism.

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The microstructural evolution and formation mechanism in Si3N4/AgCuTi/Kovar braze joints

Cited by 31 publications

References 20 publications

The diffuse interface phase‐field model for in situ interlayer phase formations in low‐temperature reaction bonding of alumina laminates—A theoretical and experimental comparison

The diffuse interface phase‐field model for in situ interlayer phase formations in low‐temperature reaction bonding of alumina laminates—A theoretical and experimental comparison

Interfacial Microstructure and Mechanical Properties of 1Cr18Ni9Ti/1Cr21Ni5Ti Stainless Steel Joints Brazed with Mn-Based Brazing Filler

Adsorption and interface reaction in direct active bonding of GaAs to GaAs using Sn–Ag–Ti solder filler

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