2021
DOI: 10.1016/j.matchar.2021.111090
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The microstructures and mechanical properties of a 5vol%SiC/AA2024 nanocomposite fabricated by powder metallurgy

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Cited by 31 publications
(7 citation statements)
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“…During cooling after the hot-pressing process of Al2024 alloy, Al 2 Cu and Al 2 CuMg phases are formed by precipitation. 28 Additionally, the B 4 C and SiC reinforcement particles do not react with the base material. As a result, the grinding time was not sufficient for the formation of the reaction, and the sintering temperature was low.…”
Section: Resultsmentioning
confidence: 99%
“…During cooling after the hot-pressing process of Al2024 alloy, Al 2 Cu and Al 2 CuMg phases are formed by precipitation. 28 Additionally, the B 4 C and SiC reinforcement particles do not react with the base material. As a result, the grinding time was not sufficient for the formation of the reaction, and the sintering temperature was low.…”
Section: Resultsmentioning
confidence: 99%
“…The fine equiaxed grains possibly resulted from the dynamic recrystallization, while the elongated coarse grains likely came from the abnormal grain growth during the SPS process. The high grain boundary energy related to the large area of grain boundaries due to the long time spent ball-milling could provide the extra thermodynamic driving force, helping grain growth [ 20 ]. After T6 heat treatment, the 1SNC-HT sample maintained a similar microstructure with a slight loss of grain size, from 424 to 411 nm, as displayed in Figure 5 a,b and Figure 6 a,b.…”
Section: Discussionmentioning
confidence: 99%
“…However, it is not easy to develop an improved procedure for simultaneously enhancing the strength and ductility. Recently, heterostructured metallic materials, including heterogeneous laminate structure [ 18 ], gradient structure [ 19 ], and bimodal structure [ 20 , 21 ], have attracted extensive attention from the materials research community. These diverse structures have a common feature: all of them consist of both soft domains and hard domains with dramatically different flow stresses.…”
Section: Introductionmentioning
confidence: 99%
“…Due to its wide band gap value, high breakdown electric field, good thermal and electrical conductivity, and high hardness and mechanical strength, SiC can be applied in the electronic (e.g., high power/high frequency devices) or automotive (e.g., brake discs) industry. [1] Silicon carbide is also used as the reinforcement in metal, [2][3][4][5][6][7][8] ceramic, [9,10] or polymer matrix composites. [11,12] SiC addition can improve the thermal or mechanical properties, [13] especially in the case of metal matrix composites.…”
Section: Introductionmentioning
confidence: 99%