2021 IEEE 32nd Magnetic Recording Conference (TMRC) 2021
DOI: 10.1109/tmrc53175.2021.9605108
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The Practical Material Challenges Involved in using the Topological Insulator BiSb in a Spin Transfer Device

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“…BiSb typically crystallizes in a rhombohedral A7 crystal structure with a specific ordered arrangement of Bi and Sb atoms, as shown in Figure a. However, the low melting point of the BiSb alloy raises concerns about Bi/Sb diffusion and phase separation, which could compromise SOT efficiency during annealing and even room-temperature (RT) aging. , Also, the TSS of BiSb thin films was reported to be significantly affected by the selection of adjacent layers. , To date, it still remains a critical aspect requiring further investigation of the phenomenon of interdiffusion in the BiSb alloy with neighboring layers and interface chemistry to fully exploit the potential of BiSb-based heterostructures for spintronic applications.…”
Section: Introductionmentioning
confidence: 99%
“…BiSb typically crystallizes in a rhombohedral A7 crystal structure with a specific ordered arrangement of Bi and Sb atoms, as shown in Figure a. However, the low melting point of the BiSb alloy raises concerns about Bi/Sb diffusion and phase separation, which could compromise SOT efficiency during annealing and even room-temperature (RT) aging. , Also, the TSS of BiSb thin films was reported to be significantly affected by the selection of adjacent layers. , To date, it still remains a critical aspect requiring further investigation of the phenomenon of interdiffusion in the BiSb alloy with neighboring layers and interface chemistry to fully exploit the potential of BiSb-based heterostructures for spintronic applications.…”
Section: Introductionmentioning
confidence: 99%