2021
DOI: 10.1360/ssc-2021-0129
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The preparation of ionic liquid doped graphene composite and its synergistic flame retardant effect with hexaphenoxy cyclotriphosphazene on epoxy resin

Abstract: In this paper, graphene doped ionic liquid nanoplatelets (GnP@ILs) were successfully synthesized by green and environmentally friendly wet ball milling from expandable graphite and 1-butyl-3-methylimidazole hexafluorophosphate ionic liquid ([BMIM]PF6), and its surface morphology, crystal structure and chemical structure were characterized. GnP@ILs alone or mixed with hexaphenoxy cyclotriphosphazene (HPCTP) was added to epoxy resin (EP) to study its effect on the comprehensive properties of EP composites. Limit… Show more

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Cited by 2 publications
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“…The endothermal peak (Figure 7E) of the cured resins (sample 0–4) is mainly attributed to the movement of chain segments in curing networks under the range of glass transition temperature ( T g ). The corresponding heat resistance index 62 ( T HRI , Table S1) and T g (peak temperature of the above endothermal peaks) are summarized in Figure 7F. T g and T HRI of E‐51/TFSA, E‐51/TFGA, TFSAEy/DDM, and TFGAEy/DDM are higher than those of E‐51/DDM.…”
Section: Resultsmentioning
confidence: 99%
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“…The endothermal peak (Figure 7E) of the cured resins (sample 0–4) is mainly attributed to the movement of chain segments in curing networks under the range of glass transition temperature ( T g ). The corresponding heat resistance index 62 ( T HRI , Table S1) and T g (peak temperature of the above endothermal peaks) are summarized in Figure 7F. T g and T HRI of E‐51/TFSA, E‐51/TFGA, TFSAEy/DDM, and TFGAEy/DDM are higher than those of E‐51/DDM.…”
Section: Resultsmentioning
confidence: 99%
“…The endothermal peak (Figure7E) of the cured resins (sample 0-4) is mainly attributed to the movement of chain segments in curing networks under the range of glass transition temperature (T g ). The corresponding heat resistance index62 (T HRI , TableS1) and T g (peak temperature of the above endothermal peaks) are summarized in Figure7F.T g and T HRI of E-51/TFSA, E-51/TFGA, TFSAEy/DDM, and TFGAEy/DDM are higher than those of E-51/DDM. Among them, TFSAEy/DDM has the highest T g and T HRI , 213.5 • C and 188.7 • C higher than those of E-51/DDM (107.2 • C and 174.8 • C), E-51/TFSA (114.0 • C and 166.4 • C), E-51/TFGA (122.8 • C and 162.4 • C), and E-51/TFGAEy (206.1 • C and 182.1 • C).…”
mentioning
confidence: 99%