The realization and design considerations of a flip-chip integrated MEMS tunable capacitor

Harsh, Kevin; Su, Bingzhi; Zhang, Wenge; Bright, Victor M.; Lee, Y.C

doi:10.1016/s0924-4247(99)00255-1

Cited by 50 publications

(22 citation statements)

References 10 publications

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“…A polysilicon "cap" structure suspended by tethers is also fabricated using a similar process. The cap is transferred onto the wall structure using a flip-chip bonding technique [24,25], thus encapsulating the MEMS device.…”

Section: Design and Fabricationmentioning

confidence: 99%

A flip–chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications

Panchawagh

Faheem

Herrmann

et al. 2007

Sensors and Actuators A: Physical

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Section: Design and Fabricationmentioning

confidence: 99%

A flip–chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications

Panchawagh

Faheem

Herrmann

et al. 2007

Sensors and Actuators A: Physical

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“…Harsh et al used this technology to transfer a MEMS tunable capacitor [7]. It is reported the successful device transfer rate is 100%.…”

Section: Flip Chip Assembly With Silicon Removalmentioning

confidence: 99%

Flip Chip Technologies and Their Applications in MEMS Packaging

Wang¹,

Bai²

2002

International Journal of Nonlinear Sciences and Numerical Simulation

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The high cost and undesirable bulky packages have been and continues to be major stumbling blocks in commercializing MEMS products. Flip chip technologies are very promising techniques for MEMS packaging. This paper presents a brief introduction of flip chip technologies as well as examples of successful applications of flip chip technologies in MEMS (e.g. RF and optical MEMS, micro sensors) packaging. The result shows that, although MEMS packaging is much more complicated than that for microelectronics, flip chip technologies can be applicable means of integrating MEMS devices. It is also shown that to meet different packaging requirements of various MEMS devices, bumping materials, bumping process and joining methods must be chosen carefully. Issues, such as package deformation, temperature distributions, heat sink placement, are all very crucial for the performance of MEMS devices and should be considered in MEMS packaging design.

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“…In addition, the relative low-cost of PCB material makes it the prime contender for the substrate of choice for RF-MEMS switches. Hence, rather than fabricating RF-MEMS switches on Si or GaAs substrates and then batch transferring them (in hybrid fashion) to a substrate where the antennas or other components are fabricated [11] and [12], we have focused our research on integrating RF-MEMS switches directly on the PCB monolithically. This approach also is expected to reduce production cost by building the integrated RF systems directly on a low-cost microwave laminate PCB.…”

mentioning

confidence: 99%

Development of RF-MEMS switch on PCB substrates with polyimide planarization

et al. 2005

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This paper describes an improved manufacturing technology for the fabrication of radio frequency (RF) microelectromechanical systems switches on a laminated printed circuit board (PCB). The process simplifies the fabrication process without sacrificing the RF performance of switches on the PCB. The proposed process patterns a 17.5-m-thick copper layer on the PCB; as a result, the surface becomes highly nonplanarized. Polyimide is then used to planarize the PCB's patterned copper layer. The use of polyimide for planarization has not only made the fabrication process simpler, but it has also reduced the formation of voids in the photoresist sacrificial layer where metallic membrane is deposited and patterned. The switches fabricated with this technology demonstrate a low insertion loss (less than 0.06 dB at 10 GHz) and good isolation (less than 20 dB at 10 GHz).Index Terms-Microelectromechanical systems (MEMS), polyimide, printed circuit board (PCB), radio frequency (RF), switch.

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The realization and design considerations of a flip-chip integrated MEMS tunable capacitor

Cited by 50 publications

References 10 publications

A flip–chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications

A flip–chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications

Flip Chip Technologies and Their Applications in MEMS Packaging

Development of RF-MEMS switch on PCB substrates with polyimide planarization

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