No abstract

MEMS-based RF components are being developed for variuos microwave and millimeter-wave applications.However, most RF MEMS have to be fabricated using GaAs, ceramics, high-resistivity silicon or other RFcompatible materials; such fabrication techniques are not commonly used by mainstream silicon-based MEMS manufacturing infrastructure. As a result, the complexity of these MEMS is limited. Using flip-chip assembly and silicon removal techniques, there is an opportunity to integrate MEMS onto any RF compatible substrate without the silicon semiconductor effects. Thus, it is possible to manufacture complex MEMS cost-effectively for a new generation of RF MEMS with superior functionality, e.g. tunable capacitors, multi-way switches and arrays of hundreds of these or other RF components. This new technology is described with an emphasis on four issues: warpage, actuators, release and flip-chip bonding.

No abstract

No abstract

A new method of assembling MEMS is being developed that uses solder surface tension force to manipulate and assemble MEMS 3-D structures. Modeling is critical to design solderjoints for precision assembly. An accurate model has been developed based on the principle of surface energy minimization. Using Surface Evolver software, this model considers threedimensional MEMS configurations with different pad dimensions, geometries, and volumes ofthe solderjoint. The software calculates solder shapes with local minimum surface energies and identifies the final shape with the global minimum energy. A two-plate popped-up MEMS structure was modeled and experimentally measured. The experiment confirmed the model could predict the fmal, equilibrium angle to within +1-2 degrees. This accuracy level is actually limited by the experimental error bar of +1-2 degrees, which was caused by the volume variation of the solder spheres used. The model's accuracy is expected to be much better. Nevertheless, the present model, with the verified accuracy, can help MEMS researchers design innovative 3-D MEMS assembled using solder.