The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

Abstract

The failure of one solder joint out of the hundreds of joints in a system compromises the reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue mechanisms working together. To better understand the failure process in thermal cycling, it is crucial to analyze both the effects of creep and fatigue mechanisms in a methodical manner. In this work, individual solder junctions are subjected to accelerated shear fatigue testing to investigate the effects of creep and fatigue on joint dependability at room temperature. A modified fixture is used to conduct fatigue tests on an Instron 5948 micromechanical tester. SAC305 joints with an OSP surface finish were cycled under stress control at first, and then the strain was maintained for a set amount of time. In this investigation, three stress amplitudes of 16, 20, and 24 MPa are used, together with varying residence periods of 0, 10, 60, and 180 s. The fatigue life of solder junctions is described for each testing condition using the two-parameter Weibull distribution. Additionally, as a function of stress amplitude and residence time, a dependability model is created. For each testing scenario, the progression of the stress–strain loops was studied. By quantifying relevant damage metrics, such as plastic work per cycle and plastic strain at various testing circumstances, the damage due to fatigue is distinguished from creep. To investigate the relationships between plastic work and plastic strain with fatigue life, the Coffin–Manson and Morrow Energy model is used. The results indicate that using greater stress magnitudes or longer dwell periods significantly shortens fatigue life and dramatically increases plastic work and plastic strain. The housing impact is significant; in some circumstances, testing with a longer dwelling period and lower stress amplitude resulted in more damage than testing with a shorter dwelling period and higher stress levels. When illustrating the fatigue behavior of solder junctions under various stress amplitudes or dwellings, the Coffin–Manson and Morrow Energy model were both useful. In the end, general reliability models are developed as functions of plastic work and plastic strain.

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

“…For the prediction of the solder fatigue life, researchers use various test methods (such as the combination of mechanical vibration and thermal cycling load test, fracture mechanics and disturbed state mixed method, and global and local methods) to investigate the deformation of solder joints under cyclic load and develop special test equipment for reliability assessment to predict the solder fatigue life [55][56][57][58]. Another researcher designed a hybrid fatigue modeling method to simulate the crack trajectory of solder joints and predict its fatigue life, which has been verified by lead-free and tin-lead solders and has achieved good results [59,60]. of solder joints.…”

Effects of interface cracks on reliability of surface mount technology interconnection in service environment

“…The temperature alternation caused by the active power cycling is not always jump, and there are dwell and ramp periods, which makes the mechanical behavior of the SMT solder joint very complex. Creep is dominant during the temperature dwell period, while the temperature ramp is the main reason for the thermal fatigue damage of solder joints (Abueed et al , 2022). On the other hand, for example, in vehicle electronic equipment, the stress alternation caused by random vibration (RV) during vehicle operation is an important reason for fatigue damage of package solder joints.…”

Applications of Crystal Plasticity in Forming Technologies

“…Therefore, it is important to understand their reliability under varying loading conditions to ensure the robust functionality of the electronic systems that now power our lives. The reliability of SAC305 Individual Solder Joints during stress-fatigue conditions at room temperature was investigated by Abueed et al [9]. They used a specially designed fixture with an Instron 5948 micromechanical tester and analyzed the stress-strain loops from different loading conditions to distinguish damage from fatigue from damage from creep.…”