The reliability of through silicon via under thermal cycling

Ma, Hui-Cai; Guo, Jingdong; Chen, Jianqiang; Zhu, Qing–Ling; Shang, Jian Ku

doi:10.1109/icept.2015.7236686

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…The effect of the indenter shape on the calculated property values is represented by the coefficient of 24.5 for the Berkovich type indenter in Equation. (2). The radius of the indenter tip need to be considered to ensure the correct determination of the projected contact area at the nanoscale [26].…”

Section: Nanoindentation Testmentioning

confidence: 99%

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Deformation mechanics of sputtered copper layers during nanoindentation tests

Afripin¹,

Fadil²,

Tamin³

2020

JMES

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The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering process, are examined. A series of nanoindentation tests are performed on the Cu coating layer samples with indenter speeds ranging from 80 to 400 nm/s, and the indentation depths of 320 nm. The properties of elastic modulus, hardness and the hardening behavior of the Cu coating layers have been quantified. Results show that the coating with higher contamination of C at 8.41 wt. % displays a significant hardening and a peak load level, as reflected in the measured nanoindentation load-displacement curves. However, insignificant effect of the applied probe displacement speeds up to 400 nm/s on the resulting properties of the coating is registered. The Johnson-Cook constitutive equation adequately describes the strain rate-dependent hardening behavior of the Cu coating layer.

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Section: Nanoindentation Testmentioning

confidence: 99%

“…Such a reliability concern over the failure of the copper layer has been addressed through experimental and computational studies e.g. [1,2]. Yielding and fracture of the copper layer has been identified as a cause of failure of the TSVs [3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%