2007
DOI: 10.1016/j.apsusc.2006.07.010
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The role of Laplace pressure in the formation of the structure of thin layers based on silicon dioxide

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Cited by 3 publications
(4 citation statements)
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“…In turn, this may serve as a confirmation of the correctness of our assumption that the excess energy gets distributed over the lattice. Comparing the results obtained in the present work with the data reported in [24], we may say that at the depth of 200 nm the temperature of annealing, achieved due to UV irradiation and energy redistribution, is equivalent to 200-250°C. The pore size distribution after plasma treatment and etching of the layers with small pores (1.1 nm) is shown in Fig.…”
Section: Treatment In не Plasmasupporting
confidence: 84%
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“…In turn, this may serve as a confirmation of the correctness of our assumption that the excess energy gets distributed over the lattice. Comparing the results obtained in the present work with the data reported in [24], we may say that at the depth of 200 nm the temperature of annealing, achieved due to UV irradiation and energy redistribution, is equivalent to 200-250°C. The pore size distribution after plasma treatment and etching of the layers with small pores (1.1 nm) is shown in Fig.…”
Section: Treatment In не Plasmasupporting
confidence: 84%
“…Such behaviour is similar to thermal annealing; a decrease in pore radius can be explained by the action of Laplacian forces. The mechanism of this process was described in [24]. In turn, this may serve as a confirmation of the correctness of our assumption that the excess energy gets distributed over the lattice.…”
Section: Treatment In не Plasmasupporting
confidence: 73%
“…This, in turn, may serve as a confirmation of the correctness of our assumption that the excess energy is redistributed over the lattice. Comparing the results obtained in the present work with the data reported in [11], we may state that the annealing temperature at a depth of 200 nm, achieved as a consequence of UV irradiation and energy redistribution, is equal to 250 o C. Figure 2 (curve 2) shows the distribution of micropores over radius after treatment in plasma and etching. It is interesting that the pores of larger radius (R ~ 2 nm) are displayed after etching, though the pores of this radius were not detected in the initial film.…”
Section: Contributedsupporting
confidence: 81%
“…Such a behaviour is similar to thermal annealing; a decrease in pore radius may be explained by the action of Laplacian forces. The mechanism of this process was described in [11]. This, in turn, may serve as a confirmation of the correctness of our assumption that the excess energy is redistributed over the lattice.…”
Section: Contributedsupporting
confidence: 77%