2017
DOI: 10.1038/ncomms14138
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The shape of telephone cord blisters

Abstract: Formation of telephone cord blisters as a result of buckling delamination is widely observed in many compressed film-substrate systems. Here we report a universal morphological feature of such blisters characterized by their sequential sectional profiles exhibiting a butterfly shape using atomic force microscopy. Two kinds of buckle morphologies, light and heavy telephone cord blisters, are observed and differentiated by measurable geometrical parameters. Based on the Föppl-von Kármán plate theory, the observe… Show more

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Cited by 43 publications
(38 citation statements)
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“…During the unloading phase, a progressive conversion from straight-sided buckles into telephone cord morphologies was observed (Figure 4). The occurrence of telephone cords during unloading is common and is consistent with the stability diagram of unilateral buckling patterns established by Parry et al [18][19][20].…”
Section: Phenomenological Aspectssupporting
confidence: 88%
“…During the unloading phase, a progressive conversion from straight-sided buckles into telephone cord morphologies was observed (Figure 4). The occurrence of telephone cords during unloading is common and is consistent with the stability diagram of unilateral buckling patterns established by Parry et al [18][19][20].…”
Section: Phenomenological Aspectssupporting
confidence: 88%
“…One striking feature of standard delamination blisters is the so-called telephone cord instability 20,23,24 which is not observed experimentally for filiform corrosion. Such an instability requires the presence of biaxial or isotropic compressive stresses.…”
Section: Discussionmentioning
confidence: 98%
“…Delamination is a general process whereby a thin layer of material separates from a substrate to form a blister. 20,21 Usually delamination processes involve films with residual compressive stresses, 22,23 which are partially relaxed through disbonding, or require the system to be under compression. 24,25 The latter case is generally preferred for experimental analysis because the displacement imposed to compress the system can be well controlled.…”
Section: Introductionmentioning
confidence: 99%
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“…According to this hypothesis, the delamination is driven by pockets of energy concentration (PECs) in the form of pockets of tensile stress and shear stress [15,16] on and around the interface between a thin film and a thick substrate. Furthermore, PECs can be caused by a number of different processes, including the commonly-seen edge cracks [2,12], indentation cracks [9], thermal cooling such as in thermal barrier coating material systems, electro-chemical reaction such as in solid thin film electrode material systems [19], and thermal heating such as surface pattern fabrication on thin films under a scanning laser beam [20]. The exact origin of PECs is not discussed in the current work; instead, the existence of PECs is taken as given and then the mechanical consequences for TCBs are established.…”
Section: Introductionmentioning
confidence: 99%