The Simulation Study of Si₃N₄Ceramics Nano-Cutting Process

Abstract

Silicon nitride nanoscale cutting model was established by molecular dynamics simulation, and interactions force between atoms of work-piece was calculated by Tersoff potential function. Through the three-dimensional simulation of silicon nitride nanocutting process, the changes of cutting force, kinetic energy and potential energy in the nanoscale cutting process, and the effects of cutting thickness and cutting speed on the entire cutting process were analyzed. The results showed that the kinetic energy, potential energy and cuting force increased along with the cutting thickness increasing, both kinetic energy and potential energy decreased with cutting speed increasing.