SiC ceramics is very promising to be widely applied due to the excellent physical and chemical properties.However, the very difficult process of SiC ceramics hinders its application. In this paper, the nano-cutting of SiC ceramics is simulated based on molecular dynamics. The influences of the tool rake and cutting depth on the cutting force, the kinetic energy and potential are analyzed. The results show that the cutting force, system kinetic energy and potential energy increase firstly,reach the maximum, and then decrease in the process; with the increase of the tool rake, the cutting force and the kinetic energy decrease; with the increase of the cutting depth, the cutting force increases, and the kinetic energy and the potential energy decreases. These results are very helpful to understanding the process mechanism of SiC ceramics and increasing its process efficiency

Silicon nitride nanoscale cutting model was established by molecular dynamics simulation, and interactions force between atoms of work-piece was calculated by Tersoff potential function. Through the three-dimensional simulation of silicon nitride nanocutting process, the changes of cutting force, kinetic energy and potential energy in the nanoscale cutting process, and the effects of cutting thickness and cutting speed on the entire cutting process were analyzed. The results showed that the kinetic energy, potential energy and cuting force increased along with the cutting thickness increasing, both kinetic energy and potential energy decreased with cutting speed increasing.

SiC ceramics have been widely used in a variety of areas due to the excellent physical and chemical properties. However, the process of SiC ceramics is difficult and high-cost, molecular simulation is an effective and feasible method to study the nano-process of SiC ceramics. In this paper, a molecular model is presented to simulate the stress and energy in the nano-cutting of SiC ceramics. The influences of the cutting depth and cutting speed on the kinetic energy and potential are analyzed. The results show that potential energy increases with the decrease of the cutting depth. Kinetic energy increases with the increase of the cutting speed. The results are very helpful for improvement the level of ultra-precision processing and nano-processing of brittle ceramics.