The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding

Ibrahim, Mohd Rusli; Teck, Siong Chin; Choi, Yong Cheng

doi:10.1109/iemt.2006.4456480

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Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bonding1

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2009

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“…Compared to 3N wire, 2N wire needed higher ultrasonic energy and a larger bond force to achieve equivalent ball sizes and ball shear strength but it showed better reliability performance (Han et al , 2007). 3N wire also showed better reliability performance than traditional 4N wire for ultra‐fine pitch wire bonding of various devices (Ibrahim et al , 2007a).…”

Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

Fine and ultra‐fine pitch wire bonding: challenges and solutions

Zhong

2009

Microelectronics International

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PurposeThe purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.Design/methodology/approachDozens of journal and conference articles published recently are reviewed.FindingsThe problems/challenges such as possible wire sweep and decreased bonding strength due to small wire sizes, non‐sticking, metal pad peeling, narrow process windows, wire open and short tail defects are analysed. The solutions to the problems and recent findings/developments in fine and ultra‐fine pitch wire bonding are discussed.Research limitations/implicationsBecause of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/valueThis paper attempts to provide an introduction to recent developments and the trends in fine and ultra‐fine pitch wire bonding. With the references provided, readers may explore more deeply by reading the original articles.

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Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

Fine and ultra‐fine pitch wire bonding: challenges and solutions

Zhong

2009

Microelectronics International

View full text Add to dashboard Cite

show abstract

The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding

Cited by 1 publication

References 5 publications

Fine and ultra‐fine pitch wire bonding: challenges and solutions

Fine and ultra‐fine pitch wire bonding: challenges and solutions

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